The relationship between dislocation density and flow stress in materials deforming by a Peierls-Nabarro mechanism.
Thermally activated deformation relating flow stress to square root of dislocation density
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Thermally activated deformation relating flow stress to square root of dislocation density
Friction stress acting upon moving dislocation derived from microstrain studies
Shear modulus effect on stress distribution of planar array of screw dislocations near bimetallic welded half-planes interface
Friction stress acting upon moving dislocation derived by microstrain methods is meaningful under limited conditions
A transition between two types of step alignment was observed in a multilayered InGaAs/GaAs quantum-dot (QD) structure. A change to larger QD sizes in smaller concentrations occurred after formation of a dislocation array.
Rapid solidification experiments have, in recent years, revealed a wealth of new microstructural phenomena that suggest a strong connection between the kinetics of solidification and the crystalline structures that emerge as a result. In this work, we investigate the interplay between interface morphology and defect-mediated processes during rapid solidification conditions using a Phase Field Crystal (PFC) model, enabling us to simultaneously and efficiently explore the physics of solidification and elasto-plasticity in the formalism of a single-field theory. We predict that there are two mechanisms by which dislocations emitted directly from the solid–liquid interface induce orientation gradients as well as the formation of subgrain boundaries within a single solidifying cell. We relate these mechanisms to the morphology of the moving solid–liquid interface and identify a suitable control parameter in the PFC model with which we can go between said morphologies by effectively changing the relative strength of the capillary length and kinetic coefficients of the solid–liquid interface. Thus, we are able to provide mechanistic explanations for several microstructural features (with an emphasis on orientation gradients and subgrain boundaries) observed during the rapid solidification of pure materials. We also provide a simple explanation for the formation of “jagged” subgrain boundaries, which is consistent with our experimental observations in rapidly solidified samples of Aluminum, whose mechanisms have thus far been unknown.
Herein this work evaluates the stress relaxation behavior of textured Zircaloy-4 cladding to understand how mechanical anisotropy influences pellet-cladding interactions. Uniaxial and biaxial stress relaxation tests are performed using full-tube axial tension and internal pressurization, respectively, aiming to achieve 0.25%, 1%, and 2% equivalent strains in the cladding samples at a temperature of 300°C. Internal pressure relaxation test results display enhanced stress relaxation compared to axial testing results, particularly for samples loaded beyond yield. Results of electron backscatter diffraction indicate increased deformation microstructure during loading and increased strain homogenization and recovery during relaxation for samples loaded via internal pressurization. Analysis indicates that the increased production and activity of basal ⟨a⟩ dislocations play a significant role in the enhanced relaxation measured in samples subjected to internal pressurization.
High resolution electron backscatter diffraction (HR-EBSD) is a technique used to map elastic strain, crystallographic orientation and dislocation density in a scanning electron microscope. Here, this review covers the background and mathematics of this technique, contextualizing it within the broader landscape of EBSD techniques and other materials characterization methods. Several case studies are presented showing the application of HR-EBSD to the study of plasticity in metals, failure analysis in microelectronics and defect quantification in thin films. This is intended to be a comprehensive resource for researchers developing this technique as well as an introduction to those wishing to apply it.
Multiple twinning to form fivefold twinned nanoparticles in crystal growth is common and has attracted broad attention ranging from crystallography research to physical chemistry and materials science. Lattice-misfit strain and defects in multiple twinned nanoparticles (MTP) are key to understand and tailor their electronic properties. However, the structural defects and related strain distributions in MTPs are poorly understood in three dimensions (3D). Here, we show the 3D atomic misfit and strain relief mechanism in fivefold twinned icosahedral nanoparticles with amorphization and dislocations by using atomic resolution electron tomography. We discover a two-sided heterogeneity in variety of structural characteristics. A nearly ideal crystallographic fivefold face is always found opposite to a less ordered face, forming Janus-like icosahedral nanoparticles with two distinct hemispheres. The disordered amorphous domains release a large amount of strain. Molecular dynamics simulations further reveal the Janus-like icosahedral nanoparticles are prevalent in the MTPs formed in liquid-solid phase transition. This work provides insights on the atomistic models for the modelling of formation mechanisms of fivefold twinned structures and computational simulations of lattice distortions and defects. We anticipate it will inspire future studies on fundamental problems such as twin boundary migration and kinetics of structures in 3D at atomic level.
GaN is rapidly gaining attention for implementation in power electronics but is still impacted by its high density of threading dislocations (TDs), which have been shown to facilitate current leakage through devices limiting their performance and reliability. Here, we discuss a novel implementation of photoluminescence (PL) imaging to study TDs in regions within vertically structured p-i-n GaN (PIN) diodes consisting of metalorganic chemical vapor deposition (MOCVD) epitaxial layers grown on ammonothermal GaN (am-GaN) substrates. PL imaging with a sub-bandgap excitation energy (3.1 eV) reveals TDs with excellent clarity in three dimensions within the am-GaN substrate. Galvanometric-driven PL imaging allows the microstructure of hundreds of devices to be characterized in a single session, enhancing the screening process through the addition of device specific TD location tracking and density mapping. The visibility, structural characteristics, luminescent nature and evolution of TDs through the GaN growth process are described, potentially providing the ability to define TD structures associated with leakage current.
Capillary evolution at bicrystal UO 2 grain boundaries is characterized using in situ transmission electron microscopy. The discontinuous nature of the densification process, both particle rotation and axial strain, along with the large activation stress for densification support a hypothesis that grain boundary strain in UO 2 follows nucleation rate limited kinetics at low to intermediate stresses, that is, less than ≈ 10 8 PA. Further, the temperature dependence of the average activation stress for sintering agrees well with analysis of bulk sintering data and creep data reported within the literature when analyzed in the context of a grain boundary dislocation nucleation rate limited kinetic model.
Dislocation relaxation of silver and copper and asymmetry of Bordoni internal friction peak of metals
Dislocations in shear deformed molybdenum crystals examined by transmission electron microscopy
Elastic-plastic shear cracks propagation in two phase composite materials using dislocation model, determining critical fracture strength
Dopant effect on dislocation mobility in elastically loaded silicon crystal using internal friction and modulus defect measurements
Double ended dislocation pileups and elastic cracks at bimaterial interface under screw, edge and shear modes
Single crystal W and W alloys dislocation structures as function of strain, temperature and dilute alloys addition, using electron microscopy
Transport mechanism for holes in polycrystalline Ge films based on Matthiessen rule, considering surface scattering and dislocation