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At least 181 records · Page 10

Photovoltaic array reliability optimization

An overview of the photovoltaic array reliability problem is presented, and a high reliability/minimum cost approach to this problem is presented. Design areas covered are cell failure, interconnect fatigue, and electrical insulation breakdown, and three solution strategies are discussed. The first involves controlling component failures in the solar cell (cell cracking, cell interconnects) and at the module level (must be statistically treated). Second, a fault tolerant circuit is designed which reduces array degradation, improves module yield losses, and controls hot-spot heating. Third, cost optimum module replacement strategies are also effective in reducing array degradation. This can be achieved by minimizing the life-cycle energy cost of the photovoltaic system. The integration of these solutions is aimed at reducing the 0.01% failure rate.

Ross, R. G., Jr.↗

Dynamic and static fatigue behavior of sintered silicon nitrides

The dynamic and static fatigue behavior of Kyocera SN220M sintered silicon nitride at 1000 C was studied. Fractographic analysis of the material failing in dynamic fatigue revealed the presence of slow crack growth (SCG) at stressing rates below 41 MPa/min. Under conditions of static fatigue this material also displayed SCG at stresses below 345 MPa. SCG appears to be controlled by microcracking of the grain boundaries. The crack velocity exponent (n) determined from both dynamic and static fatigue tests ranged from 11 to 16.

Chang, J.↗

Fatigue flaw growth and NDI evaluation for preventing through cracks in spacecraft tankage structures

A program was conducted to determine the fatigue-crack propagation behavior of parent and welded 2219-T87 aluminum alloy sheet under controlled cyclic stress conditions in room temperature air and 300 F air. Specimens possessing an initial surface defect of controlled dimensions were cycled under constant load amplitude until the propagating fatigue crack penetrated the back surface of the specimen. A series of precracked specimens were prepared to determine optimum penetrant, X-ray, ultrasonic, and eddy current nondestructive inspection procedures.

Pettit, D. E.↗

Effect of microgravity and hypergravity on embryo axis alignment during postencystment embryogenesis in Artemia franciscana (Anostraca)

Cysts of brine shrimp attached with a liquid adhesive to 12-mm diameter glass coverslips in a syringe-type fluid processing apparatus were flown aboard the NASA space shuttle Discovery, flight STS-60, from 3-11 February 1994, and were allowed to undergo postencystment embryogenesis and to hatch in microgravity. The shuttle flight and the ground-based control coverslips with attached cysts were parallel to the earth's surface during incubation in salt water. Based on the position of the cyst shell crack in the attached cyst population, the ground-control nauplii emerged mostly upward. On the shuttle in microgravity, although our method of detection of orientation would not reveal emergence toward the coverslip, the ratio of the position of the cyst shell crack in the population after hatching best fit the predicted values of a random direction for nauplii emergence. Centrifugation on earth was then used to create hypergravity forces of up to 73 g during postencystment embryogenesis and hatching. The upward orientation of emerging nauplii showed a high degree of correlation (r(2) =98.8%) with a linear relationship to the log of g, with 78.2% of the total hatching upward at 1 g and 91.0% hatching upward at 73 g.

NASA Program NSCORT↗

Low Cost (CAPEX and variable): Tool design for cell and module fabrication with thin, free-standing silicon wafers

This project aimed to develop technologies that can potentially enable free-standing thin (<80 μm) wafer in today’s manufacturing lines with high production yield, and thereby reduce capex barriers of silicon photovoltaics cells and modules. One of the major benefits is that thin wafer dramatically reduces the amount of polysilicon required. As a result, it can lead to reduction in the capital expenditures associated with polysilicon refining and wafer fabrication, which together are more than half of the total capital expenditure to manufacture Si PV module. We focused our efforts on developing the tools needed to enable high yield fabrication of wafer, cell, and module with thin silicon wafers. However, as the wafer thickness reduces, the major challenge is that wafer breakage increases significantly. Three technological areas were explored in this project to improve the production yield of the silicon wafer, namely detection of edge cracks via dark-field near-infrared (NIR) scattering; (2) wafer handling using controlled temperature profiles; (3) manufacturable low-stress cell interconnection for multiwire. First, the formation of wafer cracks in submillimeter length is one of the reasons that causes wafer breakages. Crack detection tools are needed to enable us to locate and track the wafer crack during manufacturing, so that we can improve the process to reduce initialization. The state-of-the-art crack detection technique cannot fulfill the need for measuring submillimeter edge cracks detrimental for thin wafers. The prototype developed in this project demonstrates the scanning of microcracks near wafer edges. With a semi-automatic laboratory setup, the submillimeter cracks were reliably detected near the edges in multi-Si wafers. The smallest detectable crack is 200 µm in length in slow scans; and submillimeter cracks are detected in high-throughput scans at the scan speed of >0.5 m/s, which is compatible with the inline detection of a manufacturing line at least 1 sec/wafer. This detection limit is a significant advancement in comparison to the benchmarked industrial tool. Second, wafer handling with the well-controlled temperature profile was thought to be the solution to reduce crack initiation and propagation during the manufacturing. However, without crack detection being widely adopted in production line, we did not find a strong industrial pull toward this technology. We did an initial literature survey and then diverted our efforts to the other tasks. Third, the innovation on low-stress multi-wire interconnection tackles a fundamental problem in the standard interconnection scheme. The standard over-under “zig-zag” interconnection induces a significant amount of stress into the soldering point on the cell whenever PV module is under stress, e.g., thermal cycling, transportation, and installation. Therefore, the interconnection process was re-designed in this project to allow for significant movement between adjacent solar cells, e.g., due to thermal expansion, without building up stresses on the solar cells or solder joints. The new interconnection method with the cross-connect wire also simplifies the tabbing and stringing process by replacing the standard over-under method with an off-cell interconnect from top to bottom. A manual tabbing and stringing tool for this new process was prototyped in the lab to demonstrate the fabrication of this new interconnection design. During the test with brass sheets as our “testing cells”, it was found that the mechanical cycling test only broke the interconnection after more than 50,000 cycles, which is equivalent to more than 130 years of the day-and-night thermal cycles. Lastly, throughout the project, we continuously analyzed the PV market with techno-economic analysis to identify the opportunity for thin Si adoption. Even though the drastic cost reduction has already happened in the past five years, our analysis results indicated that we can still save quite significantly in both manufacturing cost and factory capex, Particularly, in order to grow the PV manufacturing capacity to multi-terawatt level, reducing the thickness of silicon wafer is one of the most effective ways to quickly reduce factory capex, and sustain the high growth rate. The technologies developed in this project are readily available to provide some assistances in tackling the production yield problem.

14 SOLAR ENERGY↗

"Ultra"-Fast Fracture Strength of Advanced Structural Ceramic Materials Studied at Elevated Temperatures

The accurate determination of inert strength is important in reliable life prediction of structural ceramic components. At ambient temperature, the inert strength of a brittle material is typically regarded as free of the effects of slow crack growth due to stress corrosion. Therefore, the inert strength can be determined either by eliminating active species, especially moisture, with an appropriate inert medium, or by using a very high test rate. However, at elevated temperatures, the concept or definition of the inert strength of brittle ceramic materials is not clear, since temperature itself is a degrading environment, resulting in strength degradation through slow crack growth and/or creep. Since the mechanism to control strength is rate-dependent viscous flow, the only conceivable way to determine the inert strength at elevated temperatures is to utilize a very fast test rate that either minimizes the time for or eliminates slow crack growth. Few experimental studies have measured the elevated-temperature, inert (or "ultra"-fast fracture) strength of advanced ceramics. At the NASA Lewis Research Center, an experimental study was initiated to better understand the "ultra"-fast fracture strength behavior of advanced ceramics at elevated temperatures. Fourteen advanced ceramics - one alumina, eleven silicon nitrides, and two silicon carbides - have been tested using constant stress-rate (dynamic fatigue) testing in flexure with a series of stress rates including the "ultra"-fast stress rate of 33 000 MPa/sec with digitally controlled test frames. The results for these 14 advanced ceramics indicate that, notwithstanding possible changes in flaw populations as well as flaw configurations because of elevated temperatures, the strength at 33 000 MPa/sec approached the room-temperature strength or reached a higher value than that determined at the conventional test rate of 30 MPa/sec. On the basis of the experimental data, it can be stated that the elevated-temperature, inert strength of an advanced ceramic material can be defined as the strength where no slow crack growth takes place at the temperature.

Choi, Sung R.↗

Effect of Microstructure on Time Dependent Fatigue Crack Growth Behavior In a P/M Turbine Disk Alloy

A study was conducted to determine the processes which govern hold time crack growth behavior in the LSHR disk P/M superalloy. Nineteen different heat treatments of this alloy were evaluated by systematically controlling the cooling rate from the supersolvus solutioning step and applying various single and double step aging treatments. The resulting hold time crack growth rates varied by more than two orders of magnitude. It was shown that the associated stress relaxation behavior for these heat treatments was closely correlated with the crack growth behavior. As stress relaxation increased, the hold time crack growth resistance was also increased. The size of the tertiary gamma' in the general microstructure was found to be the key microstructural variable controlling both the hold time crack growth behavior and stress relaxation. No relationship between the presence of grain boundary M23C6 carbides and hold time crack growth was identified which further brings into question the importance of the grain boundary phases in determining hold time crack growth behavior. The linear elastic fracture mechanics parameter, Kmax, is unable to account for visco-plastic redistribution of the crack tip stress field during hold times and thus is inadequate for correlating time dependent crack growth data. A novel methodology was developed which captures the intrinsic crack driving force and was able to collapse hold time crack growth data onto a single curve.

Telesman, Ignacy J.↗

Elevated temperature crack growth

The objective of the Elevated Temperature Crack Growth Project is to evaluate proposed nonlinear fracture mechanics methods for application to combustor liners of aircraft gas turbine engines. During the first year of this program, proposed path-independent (P-I) integrals were reviewed for such applications. Several P-I integrals were implemented into a finite-element postprocessor which was developed and verified as part of the work. Alloy 718 was selected as the analog material for use in the forthcoming experimental work. A buttonhead, single-edge notch specimen was designed and verified for use in elevated-temperature strain control testing with significant inelastic strains. A crack mouth opening displacement measurement device was developed for further use.

Yau, J. F.↗

Random loading fatigue crack growth: Crack closure considerations

The prediction of fatigue crack growth is an important element of effective fracture control for metallic structures and mechanical components, especially in the aerospace industry. The prediction techniques available and applied today are mostly based on fatigue crack growth measurements determined in constant amplitude testing. However, while many service loadings are constant amplitude, many more loadings are random amplitude. An investigation to determine which statistics of random loadings are relevant to fatigue crack closure was conducted. The fundamentals of random processes and crack closure are briefly reviewed, then the relevance of certain random process parameters to the crack closure calculation are discussed qualitatively. A course for further research is outlined.

Ortiz, Keith↗

Crack detection in fuel cell electrodes using a spatial filtering technique for overcoming noisy backgrounds

Image processing is a powerful tool that allows for rapid and automated data parsing in settings that occupy large variable spaces and require large data sets. Feature detection on difficultly discerned backgrounds is a subset of image processing that facilitates the extraction of quantitative metrics from otherwise subjective data. Crack detection and quantification is an important capability in polymer electrolyte membrane fuel cell quality control, failure analysis, and optimization. This work presents a technique to perform crack detection and quantification which overcomes challenges faced by commonly used image segmentation techniques. We demonstrate the use of a geometrically filtered noise‐level detection technique to select a binary threshold value from which we then quantify how cracked a sample is. Furthermore, we demonstrate the accuracy of our technique using programmatically generated test images of known crack amounts and their performance on real‐world fuel cell catalyst layer samples.

30 DIRECT ENERGY CONVERSION↗

An Application of a New Electromagnetic Sensor to Real-Time Monitoring of Fatigue Crack Growth in Thin Metal Plates

A major part of fracture mechanics is concerned with studying the initiation and propagation of fatigue cracks. This typically requires constant monitoring of crack growth during fatigue cycles which necessitates automation of the whole process. If the rate of crack growth can be determined the experimenter can vary externally controlled parameters such as load level, load cycle frequency and so on. Hence, knowledge of the precise location of the crack tip at any given time is very valuable. One technique currently available for measuring fatigue crack length is the DC potential drop method. The method, however, may be inaccurate if the direction of crack growth deviates considerably from what was assumed initially or the curvature of the crack becomes significant. Another approach is to digitize an optical image of the test specimen surface and then apply a pattern recognition technique to locate the crack tip, but this method is still under development. The present work is an initial study on applying eddy current-type probes to monitoring fatigue crack growth. The performance of two types of electromagnetic probes, a conventional eddy current probe and a newly developed self-nulling probe, was evaluated for the detection characteristics at and near the tips of fatigue cracks. The scan results show that the latter probe provides a very well defined local maximum in its output in the crack tip region suggesting the definite possibility of precisely locating the tip, while the former provides a somewhat ambiguous distribution of the sensor output in the same region. The paper is organized as follows: We start by reviewing the design and performance characteristics of the self-nulling probe and then describe the scan results which demonstrate the basic properties of the self-nulling probe. Next, we provide a brief description of the software developed for tracing a simulated crack and give a brief discussion of the main results of the test. The final section summarizes the major accomplishments of the present work and the elements of the future R&D needs.

Namkung, M.↗

The effect of water vapor on fatigue crack Growth in 7475-t651 aluminum alloy plate

The effects of water vapor on fatigue crack growth in 7475-T651 aluminum alloy plate at frequencies of 1 Hz and 10 Hz were investigated. Twenty-five mm thick compact specimens were subjected to constant amplitude fatigue testing at a load ratio of 0.2. Fatigue crack growth rates were calculated from effective crack lengths determined using a compliance method. Tests were conducted in hard vacuum and at water vapor partial pressures ranging from 94 Pa to 3.8 kPa. Fatigue crack growth rates were frequency insensitive under all environment conditions tested. For constant stress intensity factor ranges crack growth rate transitions occurred at low and high water vapor pressures. Crack growth rates at intermediate pressures were relatively constant and showed reasonable agreement with published data for two Al-Cu-Mg alloys. The existence of two crack growth rate transitions suggests either a change in rate controlling kinetics or a change in corrosion fatigue mechanism as a function of water vapor pressure. Reduced residual deformation and transverse cracking specimens tested in water vapor versus vacuum may be evidence of embrittlement within the plastic zone due to environmental interaction.

Dicus, D. L.↗

Effect of water vapor on fatigue crack growth in 7475-T651 aluminum alloy plate

The effects of water vapor on fatigue crack growth in 7475-T651 aluminum alloy plate at frequencies of 1 Hz and 10 Hz were investigated. Twenty-five mm thick compact specimens were subjected to constant amplitude fatigue testing at a load ratio of 0.2. Fatigue crack growth rates were calculated from effective crack lengths determined using a compliance method. Tests were conducted in hard vacuum and at water vapor partial pressures ranging from 94 Pa to 3.8 kPa. Fatigue crack growth rates were frequency insensitive under all environment conditions tested. For constant stress intensity factor ranges crack growth rate transitions occurred at low and high water vapor pressures. Crack growth rates at intermediate pressures were relatively constant and showed reasonable agreement with published data for two Al-Cu-Mg alloys. The existence of two crack growth rate transitions suggests either a change in rate controlling kinetics or a change in corrosion fatigue mechanism as a function of water vapor pressure. Reduced residual deformation and transverse cracking specimens tested in water vapor versus vacuum may be evidence of embrittlement within the plastic zone due to environmental interaction.

Dicus, D. L.↗

Stress-corrosion cracking in metals

Criteria and recommended practices for preventing stress-corrosion cracking from impairing the structural integrity and flightworthiness of space vehicles are presented. The important variables affecting stress-corrosion cracking are considered to be the environment, including time and temperature; metal composition, and structure; and sustained tensile stress. For designing spacecraft structures that are free of stress-corrosion cracking for the service life of the vehicle the following rules apply: (1) identification and control of the environments to which the structure will be exposed during construction, storage, transportation, and use; (2) selection of alloy compositions and tempers which are resistant to stress-corrosion cracking in the identified environment; (3) control of fabrication and other processes which may introduce residual tensile stresses or damage the material; (4) limitation of the combined residual and applied tensile stresses to below the threshold stress level for the onset of cracking throughout the service life of the vehicle; and (5) establishment of a thorough inspection program.

Source record↗

Controlled exposure of CuO thin films through corrosion-protecting, ALD-deposited TiO 2 overlayers

Ultra-thin film coatings are used to protect semiconductor photoelectrodes from the harsh chemical environments common to photoelectrochemical energy conversion. These layers add contact transfer resistance to the interface that can result in a reduction of photoelectrochemical energy conversion efficiency of the photoelectrode. Here, we describe the concept of a partial protection layer, which allows for direct chemical access to a small fraction of the semiconductor underlayer for further functionalization by an electrocatalyst. The rest of the interface remains protected by a stable, inert protection layer. CuO is used as a model system for this scheme. Atomic layer deposition (ALD)-prepared TiO 2 layers on CuO thin films prepared from electrodeposited Cu 2 O allow for the control of interfacial morphology to intentionally expose the CuO underlayer. The ALD-TiO 2 overlayer shrinks during crystallization, while Cu 2 O in the underlayer expands during oxidation. As a result, the TiO 2 protection layer cracks to expose the oxidized underlying CuO layer, which can be controlled by preceding thermal oxidation. Furthermore, this work demonstrates a potentially promising strategy for the parallel optimization of photoelectrochemical interfaces for chemical stability and high performance.

14 SOLAR ENERGY↗

Mesoporous Thin Film Architectures: Addressing Material Demands through Molecular Self-Assembly

Mesoporous thin films spark interest across a wide range of disciplines due to their tunable nanostructures, large internal surface areas, and strong compatibility with planar optical, electronic, and microfluidic devices. While attention in the porous materials community has shifted toward macroporous or disordered nanoporous systems, a resurgence in mesoporous thin film research is underway, driven by new molecular self-assembly methods, advanced materials chemistry, and improved characterization techniques. The integration of high-χN block copolymer design, kinetically persistent micelle templating, and postdeposition processing protocols now allows control over structural parameters such as pore size, wall thickness, porosity, and connectivity. These advances have overcome many of the thermodynamic and processing constraints that previously limited widespread adoption. Rather than serving only as high-surface-area supports, mesoporous thin films are engineered as active interfaces where responsive chemistries and nanoscale confinement act in tandem. Embedding switchable ligands, thermoresponsive polymers, redox mediators, or ion-selective groups directly within the pore walls enables real-time control over transport, optical, and electrochemical properties. These capabilities open up new directions in adaptive coatings, gated membranes, and fast-response biosensors. To further expand their functional scope, mesoporous films are integrated into hierarchical and multicomponent architectures. Techniques such as triblock terpolymer templating, crack-directed assembly, and nanoimprint lithography allow for control over spatial organization on the micron and submicron scale and pore system orientation. This enables programmable anisotropy, enhanced molecular diffusion, and wavelength-selective photonic behavior, essential for next-generation sensing, catalysis, and energy applications. Such structural and functional complexity requires equally sophisticated characterization. Multimodal and in situ techniques can track material dynamics under operational conditions. Recent progress includes extended-range ellipsometric porosimetry (EP) for hierarchical architectures, vacuum EP for interface energetics, time-resolved EP for diffusion kinetics, and correlative AFM-SAXS mapping. The introduction of advanced neutron-based spectroscopies, particularly quasielastic neutron scattering (QENS), promises to provide real-time access to ion transport dynamics and segmental motion under nanoscale confinement, offering a path toward deeper mechanistic understanding of structure-performance correlations in mesoporous systems. This Account reflects the technical advances made and the interdisciplinary collaborations that have shaped our collective vision. The particular dimensions of mesopores enable us to subtly tune interactions at the molecular, interfacial, and mesoscopic levels that permit us to harness nanoconfinement. What emerges is a versatile, modular platform capable of chemical gating, energy transduction, and sensing with a level of tunability unmatched by other porous materials. We highlight critical challenges including the need for more robust large-area processing, a deeper understanding of dynamic behavior under cycling, and better integration with device-level architectures. Our strategies support the transition of mesoporous thin films into active high-performance components in next-generation energy, environmental, and biomedical systems.

oxides↗

Updated Fatigue-Crack-Growth And Fracture-Mechanics Software

NASA/FLAGRO 2.0 developed as analytical aid in predicting growth and stability of preexisting flaws and cracks in structural components of aerospace systems. Used for fracture-control analysis of space hardware. Organized into three modules to maximize efficiency in operation. Useful in: (1) crack-instability/crack-growth analysis, (2) processing raw crack-growth data from laboratory tests, and (3) boundary-element analysis to determine stresses and stress-intensity factors. Written in FORTRAN 77 and ANSI C.

Forman, Royce G.↗

Control Design Strategies to Enhance Long-Term Aircraft Structural Integrity

Over the operational lifetime of both military and civil aircraft, structural components are exposed to hundreds of thousands of low-stress repetitive load cycles and less frequent but higher-stress transient loads originating from maneuvering flight and atmospheric gusts. Micro-material imperfections in the structure, such as cracks and debonded laminates, expand and grow in this environment, reducing the structural integrity and shortening the life of the airframe. Extreme costs associated with refurbishment of critical load-bearing structural components in a large fleet, or altogether reinventoring the fleet with newer models, indicate alternative solutions for life extension of the airframe structure are highly desirable. Increased levels of operational safety and reliability are also important factors influencing the desirability of such solutions. One area having significant potential for impacting crack growth/fatigue damage reduction and structural life extension is flight control. To modify the airframe response dynamics arising from command inputs and gust disturbances, feedback loops are routinely applied to vehicles. A dexterous flight control system architecture senses key vehicle motions and generates critical forces/moments at multiple points distributed throughout the airframe to elicit the desired motion characteristics. In principle, these same control loops can be utilized to influence the level of exposure to harmful loads during flight on structural components. Project objectives are to investigate and/or assess the leverage control has on reducing fatigue damage and enhancing long-term structural integrity, without degrading attitude control and trajectory guidance performance levels. In particular, efforts have focused on the effects inner loop control parameters and architectures have on fatigue damage rate. To complete this research, an actively controlled flexible aircraft model and a new state space modeling procedure for crack growth have been utilized. Analysis of the analytical state space model for crack growth revealed the critical mathematical factors, and hence the physical mechanism they represent, that influenced high rates of airframe crack growth. The crack model was then exercised with simple load inputs to uncover and expose key crack growth behavior. To characterize crack growth behavior, both "short-term" laboratory specimen test type inputs and "long-term" operational flight type inputs were considered. Harmonic loading with a single overload revealed typical exponential crack growth behavior until the overload application, after which time the crack growth was retarded for a period of time depending on the overload strength. An optimum overload strength was identified which leads to maximum retardation of crack growth. Harmonic loading with a repeated overload of varying strength and frequency again revealed an optimum overload trait for maximizing growth retardation. The optimum overload strength ratio lies near the range of 2 to 3 with dependency on frequency. Experimental data was found to correlate well with the analytical predictions.

Newman, Brett A.↗