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168 records · Page 10

General technique for the integration of MIC/MMIC'S with waveguides

A technique for packaging and integrating of a microwave integrated circuit (MIC) or monolithic microwave integrated circuit (MMIC) with a waveguide uses a printed conductive circuit pattern on a dielectric substrate to transform impedance and mode of propagation between the MIC/MMIC and the waveguide. The virtually coplanar circuit pattern lies on an equipotential surface within the waveguide and therefore makes possible single or dual polarized mode structures.

Geller, Bernard D.↗

Packaging of microwave integrated circuits operating beyond 100 GHz

Several methods of packaging high speed (75-330 GHz) InP HEMT MMIC devices are discussed. Coplanar wirebonding is presented with measured insertion loss of less than 0.5dB and return loss better than -17 dB from DC to 110 GHz. A motherboard/daughterboard packaging scheme is presented which supports minimum loss chains of MMICs using this coplanar wirebonding method. Split waveguide block packaging approaches are presented in G-band (140-220 GHz) with two types of MMIC-waveguide transitions: E-plane probe andantipodal finline.

HEMT MMICS power amplifiers↗

Novel Micro Strip-to-Waveguide Feed Employing a Double-Y Junction

Previous micro strip -to -waveguide transitions either required a hermetically sealed waveguide configuration, or a balun that needed to be tuned according to the frequency band of interest. In this design, the balun is realized using a double -Y junction to transition from microstrip to coplanar strip feeding a quasi-Yagi dipole array (see figure). The length of the feed (Lf) extending into the waveguide is 15.54 mm. The length of the ground plane below the ULTRALAM substrate is 7.75 mm. The lengths L1 , L2, and L3 are 8.50 mm, 4.38 mm, and 2.14 mm, respectively. These lengths were computed via a preliminary optimization aimed at improving the return loss at the band edges. The waveguide feed was designed to excite the TE10 mode in a WR-90 waveguide, and to operate over the recommended frequencies of 8.2 to 12.4 GHz. The feed employs a Rogers 6010 substrate (dielectric constant Er approx. equals 10.2) bonded with a Rogers ULTRALAM substrate (Er approx. equals 2.5). The ULTRALAM substrate serves to provide mechanical strength for 6010 substrate, and to mitigate loses due to parasitic modes (the ground plane is etched on the bottom of this layer due to the topology of the double -Y balun). The double-Y balun transitioning from an unbalanced microstrip line to a balanced coplanar strip (CPS) line does not provide inherent impedance transformation; hence, Klopfenstein impedance tapers were synthesized to transition from 50 to 77 Ohms in the microstrip section and from 77 to 110 Ohms in the CPS section. At the balun junction, the CPS stub lengths were chosen such that the X/ 8 resonance is pushed outside the bandwidth of operation. Also, the smallest allowable conductor width and gap spacing were chosen to meet acceptable manufacturing tolerances.

Venkatesan, Jaikrishina↗

On-Wafer Testing of Circuits Through 220 GHz

We have jointly developed the capability to perform on-wafer s-parameter and noise figure measurements through 220 GHz. S-parameter test sets have been developed covering full waveguide bands of 90-140 GHz (WR-08) and 140-220 GHz (WR-05). The test sets have been integrated with coplanar probes to allow accurate measurements on-wafer. We present the design and performance of the test sets and wafer probes. We also present calibration data as well as measurements of active circuits at frequencies as high as 215 GHz.

Gaier, Todd↗

Investigation of a GaAlAs Mach-Zehnder electro-optic modulator

A GaAs modulator operating at 0.78 to 0.88 micron wavelength has the potential to be integrated with a GaAs/GaAlAs laser diode for an integrated fiber-optic transmitter. A travelling-wave Mach-Zehnder modulator using the electro-optic effect of GaAs and operating at a wavelength of 0.82 microns has been investigated for the first time. A four layer Strip-loaded ridge optical waveguide has been analyzed using the effective index method and single mode waveguides have been designed. The electro-optic effect of GaAs has also been analyzed and a modulator using the geometry producing the maximum phase shift has been designed. A coplanar transmission line structure is used in an effort to tap the potentially higher bandwidth of travelling-wave electrodes. The modulator bandwidth has been calculated at 11.95 GHz with a required drive power of 2.335 Watts for full intensity modulation. Finally, some preliminary experiments were performed to characterize a fabrication process for the modulator.

Materna, David M.↗

Ka-Band TWT High-Efficiency Power Combiner for High-Rate Data Transmission

A four-port magic-T hybrid waveguide junction serves as the central component of a high-efficiency two-way power combiner circuit for transmitting a high-rate phase-modulated digital signal at a carrier frequency in the Ka-band (between 27 and 40 GHz). This power combiner was developed to satisfy a specific requirement to efficiently combine the coherent outputs of two traveling-wavetube (TWT) amplifiers that are typically characterized by power levels on the order of 100 W or more. In this application, the use of a waveguide-based power combiner (instead of a coaxial-cable- or microstrip-based power combiner, for example) is dictated by requirements for low loss, high power-handling capability, and broadband response. Combiner efficiencies were typically 90 percent or more over both the linear and saturated output power regions of operation of the TWTs . Figure 1 depicts the basic configuration of the magic-T hybrid junction. The coherent outputs of the two TWTs enter through ports 1 and 4. As a result of the orientations of the electromagnetic fields, which also provides a needed high port-to-port isolation, of these two input signals and the interior design of the magic-T junction, the input powers are divided so as to add in phase at one output port (port 2), and to be opposite in phase and hence cancel each other at the opposite coplanar output port (port 3). The net result is that the output power at port 2 is essentially double that of the output of one TWT, minus the power lost in the magic-T hybrid junction. Optimum performance as a high-efficiency power combiner thus requires a balance of both power and phase at the input ports of the magic-T. Replicas of this two-way combiner can be arranged in a binary configuration to obtain a 2n-way (where n is an integer) combiner. For example, Figure 2 illustrates the use of three two-way combiners to combine the outputs of four TWTs.

Wintucky, Edwin G.↗