SEARCH · Engineering Papers

Results for “Bonding”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

SourceResearch connectionFrom yearThrough year

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 181 records · Page 10

All sources NASA NTRS DOE OSTI

NASA NTRS1975

The relationship between reliability and bonding techniques in hybrid microcircuits

Differential thermal expansion was shown to be responsible for many observed failures in ceramic chip capacitors mounted on alumina substrates. It is shown that the mounting techniques used in bonding the capacitors have a marked effect upon the thermally induced mechanical stress and thus the failure rate. A mathematical analysis was conducted of a composite model of the capacitor-substrate system to predict the magnitude of thermally induced stresses. It was experimentally observed that the stresses in more compliant bonding systems such as soft lead tin and indium solders are significantly lower than those in hard solder and epoxy systems. The marked dependence upon heating and cooling rate was proven to be a determining factor in the prediction of failure solder systems. It was found that the harder or higher melting solders are less susceptible to thermal cycling effects but that they are more likely to fail during initial processing operations. Strain gage techniques were used to determine thermally induced expansion stresses of the capacitors and the alumina substrates. The compliance of the different bonding mediums was determined. From the data obtained, several recommendations are made concerning the optimum bonding system for the achievement of maximum reliability.

Caruso, S. V.↗

NASA NTRS1976

Cyclic debonding of unidirectional composite bonded to aluminum sheet for constant-amplitude loading

Cyclic debonding rates were measured during constant-amplitude loading of specimens made of graphite/epoxy bonded to aluminum and S-glass/epoxy bonded to aluminum. Both room-temperature and elevated-temperature curing adhesives were used. Debonding was monitored with a photoelastic coating technique. The debonding rates were compared with three expressions for strain-energy release rate calculated in terms of the maximum stress, stress range, or a combination of the two. The debonding rates were influenced by both adherent thickness and the cyclic stress ratio. For a given value of maximum stress, lower stress ratios and thicker specimens produced faster debonding. Microscopic examination of the debonded surfaces showed different failure mechanisms both for identical adherends bonded with different adhesive and, indeed, even for different adherends bonded with identical adhesives. The expressions for strain-energy release rate correlated the data for different specimen thicknesses and stress ratios quite well for each material system, but the form of the best correlating expression varied among material systems. Empirical correlating expressions applicable to one material system may not be appropriate for another system.

Roderick, G. L.↗

NASA NTRS1975

Preliminary evaluation of a novel polyimide adhesive for bonding titanium and reinforced composites

A novel polyimide has been developed which shows promise as an adhesive for bonding titanium-to-titanium, titanium-to-polyimide composite and composite-to-composite with excellent lap shear strengths at room temperature and moderate strengths at 288 C. The adhesive is a high molecular weight polyimide made from commercially available monomers. The use of an ether as the solvent for the polymerization and for application of the polyamic acid enhanced the adhesive properties of the polyimide. At room temperature, P13N/glass composite bonded to titanium or to itself failed primarily in the surface layer of the composite, whereas at 260 C the failure was primarily cohesive. Failure of the P13N/unidirectional HT-S graphite composite-to-titanium bonded composites occurred in the composite regardless of the test temperature. Preliminary shear results with cross-plied P13N/HT-S graphite composite-to-composite specimens showed failure in the bonded surface fibers.

Progar, D. J.↗

NASA NTRS1975

Two-electron bond-orbital model. I

The one-electron bond-orbital model of Harrison (1973) for tetrahedrally coordinated solids is modified to a two-electron model using a generalization of Falicov and Harris' (1969) method for treating the hydrogen molecule. Expressions for nuclear-exchange and pseudodipolar interactions are obtained in terms of bond-orbital model parameters. The eigenfunctions and eigenvalues of the Hamiltonian are employed along with standard perturbation theory to calculate the energy shifts resulting from the application of an external electric field and induced by the magnetic interaction between the nuclear spins and the bond-electron spins. The quantitative predictions of the derived formulas are examined for real semiconductors involving elements and compounds from periodic groups III, IV, and V. It is concluded that the present two-electron model makes it possible to assess the quantitative effects of electron correlation in the anion-cation bond for both nonmagnetic properties (electric susceptibility, dielectric constant) and magnetic properties (nuclear-exchange and pseudodipolar interactions) of various materials.

Huang, C.↗

NASA NTRS1976

On a model of calculating bond strength

Diffusion bonding is a fabricating process to join the fibers and a matrix together forming a composite. The efficiency of the bonding process depends on temperature, time, and pressure. Based on a simplified pair potential model, an expression for the bond-energy at the fiber-matrix interface is formulated in terms of the above-mentioned three parameters. From this expression and the mean atomic distance, the bond-strength between the fibers and the matrix can be calculated.

Yue, A. S.↗

NASA NTRS1976

Gas interaction effects on lunar bonded particles and their implications

Results are reported for an experimental investigation of gas-interaction effects on different Apollo 11 and Apollo 12 lunar-soil samples containing bonded particles. In the experiments, lunar fines were exposed to pure O2, pure water vapor, HCl, NH3, N2, HCOOH, and CH3NH2, in order to observe whether bonded particles would separate. In addition, repeated gas adsorption/desorption measurements were performed to determine the nature and reactive properties of the particle surfaces, and surface areas were measured for comparison with analogous terrestrial samples to determine whether the surface areas of highly radiation-damaged particles were larger or smaller. It is found that N2 is apparently ineffective in separating bonded particles and that the ratio of Apollo 11 to Apollo 12 bonded particles separated by a particular gas exposure ranges from 2.5 to 3.0. Possible reasons for differences in material surface properties at the two Apollo sites are considered, and it is concluded that material from a certain depth at some other site was transported to the Apollo 12 site and mixed with the original material in recent years (considerably less than 2000 years ago).

Mukherjee, N. R.↗

NASA NTRS1976

Polyimide adhesives for weld-bonding titanium

Two weld bonding processes were developed for joining titanium alloy; one process utilizes a weld-through technique and the other a capillary-flow technique. The adhesive used for the weld-through process is similar to the P4/A5F system and a new adhesive system, CP/CFA, was used in the capillary-flow process. Static property information was generated for weld-bonded joints over the temperature range of 219K (-65 F) to 561K (550 F) and fatigue strength information was generated at room temperature. Significant improvement in fatigue strength was demonstrated for weld-bonded joints over spot-welded joints. A demonstration was made of the applicability of weld-bonding for fabricating stringer stiffened skin panels.

Vaughan, R. W.↗

NASA NTRS1979

Effects of yttrium, aluminum, and chromium concentrations in bond coatings on the performance of zirconia-yttria thermal barriers

A cyclic furnace study was conducted between 990 - 280 C and 1095 - 280 C to evaluate the effects of yttrium, chromium, and aluminum concentrations in nickel base alloy bond coatings and also the effect of the bond coating thickness on the performance of yttria-stabilized zirconia thermal barrier coatings. The presence and the concentration of yttrium is very critical. Without yttrium, rapid oxidation of Ni-Al, Ni-Cr, and Ni-Cr-Al bond coatings causes zirconia thermal barrier coatings to fail very rapidly. Concentrations of chrominum and aluminum in Ni-Cr-Al-Y bond coating have a very significant effect on the thermal barrier coating life. This effect, however, is not as great as that due to yttrium. Furthermore, the thickness and the thickness uniformity also have a very significant effect on the life of the thermal barrier system.

Stecura, S.↗

NASA NTRS1981

The Structure and Properties of Diffusion Assisted Bonded Joints in 17-4 PH, Type 347, 15-5 PH and Nitronic 40 Stainless Steels

Diffusion assisted bonds are formed in 17-4 PH, 15-5 PH, type 347 and Nitronic 40 stainless steels using electrodeposited copper as the bonding agent. The bonds are analyzed by conventional metallographic, electron microprobe analysis, and scanning electron microscopic techniques as well as Charpy V-notch impact tests at temperatures of 77 and 300 K. Results are discussed in terms of a postulated model for the bonding process.

Wigley, D. A.↗

NASA NTRS1980

Screening of high temperature adhesives for large area bonding

High temperature-resistant adhesive systems were screened for processability, mechanical and physical properties, operational capability at 589 K (600 F), and the ability to produce large area bonds of high quality in fabricating Space Shuttle components. The adhesives consisted primarily of polyimide systems, including FM34B-18, NR-150B2 (DuPont), PMR-15, LARC-13, LARC-160, Thermid 600, and AI-1130L (AMOCA). The processing studies included preparation of polyimide resins, fabrication of film adhesives, development of lay-up and cure procedures, fabrication of honeycomb sandwich panels, and fabrication of mid-plane bonded panels in joints up to 30.5 cm (12 in.) wide. The screening program included tests for tack and drape properties, reticulation and filleting characteristics, ability to produce void-free or low porosity bonds in mid-plane bonded panels, out-time stability, lap shear strength, climbing drum peel strength, and glass transition temperature (Tg). This paper describes the processing methods developed and the test results.

Stenersen, A. A.↗

NASA NTRS1981

Calculation of activation energies for hydrogen-atom abstractions by radicals containing carbon triple bonds

Activation energies are calculated by the bond-energy-bond-order (BEBO) and the bond-strength-bond-length (BSBL) methods for the reactions of C2H radicals with H2, CH4, and C2H6 and for the reactions of CN radicals with H2 and CH4. The BSBL technique accurately predicts the activation energies for these reactions while the BEBO method yields energies averaging 9 kcal higher than those observed. A possible reason for the disagreement is considered.

Brown, R. L.↗

NASA NTRS1982

Cyclic debonding of adhesively bonded composites

The fatigue behavior of a simple composite to composite bonded joint was analyzed. The cracked lap shear specimen subjected to constant amplitude cyclic loading was studied. Two specimen geometries were tested for each bonded system: (1) a strap adherend of 16 plies bonded to a lap adherend of 8 plies; and (2) a strap adherend of 8 plies bonded to a lap adherend of 16 plies. In all specimens the fatigue failure was in the form of cyclic debonding with some 0 deg fiber pull off from the strap adherend. The debond always grew in the region of adhesive that had the highest mode (peel) loading and that region was close to the adhesive strap interface.

Mall, S.↗

NASA NTRS1983

On the nature of the bonding in Cu2 - An ab initio viewpoint

The bonding in Cu2 has been calculatively investigated. A CASSCF calculation is performed where the two 4s electrons are distributed in all possible ways among the 4s and 4p orbitals. The CAS results have a 3d population of 9.99. The corresponding orbitals between the CAS core orbitals at r(e) and the atomic SCF core orbitals show an overlap of 13.9992 out of a possible 14, with all of the change in sigma space. Thus, the CAS results show virtually no change in the d orbitals relative to the atom and can be considered as showing only a single bond. The reduction in 3d population, the decrease in r(e), and the increase in D(e) upon correlating the 3d shell indicates that the 3d electrons are slightly involved in the bonding, but there is no indication of the formation of a triple bond.

Bauschlicher, C. W., Jr.↗

NASA NTRS1985

Rapid Adhesive Bonding for Metals and Composites

Toroidal induction heater is key element in rapid bonding technique. Rapid adhesive bonding equipment features toroid induction heater for quick bonding of composites and metals. Process avoids damaging composites that cannot withstand high temperatures for long time intervals. Process scaled up for production. Technique suited to bonding of end tabs onto material test specimens.

Stein, B. A.↗

NASA NTRS1984

Effect of preforming adherends on static and fatigue strength of bonded composite single-lap joints

An analytical and experimental investigation was conducted on bonded composite single-lap joints with the adherends performed to reduce the angle between the line of action of the applied in-plane force and the bondline. A classical closed-form solution was used to analyze the composite joints with various preform angles and overlap lengths. The adherends of the test specimens were preformed before bonding, during the layup and curing process. Static tests were conducted for preform angles of 0, 5, 10, and 15 deg and overlap lengths of 0.75, 1.75, 2.75, and 3.75 in. A limited fatigue study was conducted for specimens with a 2.75-in. overlap and a preform angle of 5 deg. Results of the analysis showed that preforming the adherends of bonded composite single-lap joints significantly reduced the shear and peel stress concentrations in the adhesive. Experimental results showed that preforming the adherends significantly increased their static and fatigue strength and thus increased the load level for which bonded composite single-lap joints can be designed.

Sawyer, J. W.↗

NASA NTRS1984

Influence of aluminum oxide film on thermocompression bonding of gold wire to evaporated aluminum film

The influence of Al surface condition on the thermocompression bonding of Au wires to Al electrodes for integrated electric circuits was studied. Au wires were connected to Al electrodes by nail-head bonding after various Al surface treatments. Bonding was evaluated by measuring the wire pull strength and fraction of the number of failures at Au-Al bonds to the total number of failures. Dependence of the fraction on applied load was derived theoretically with a parameter named critical load to take into consideration the differences in Al surface condition. The relation also held explicately for various surface treatments. Characterization of the Al surface was carried out by electron microscopy for chemical analysis.

Iwata, S.↗

NASA NTRS1985

Characterization of mode 1 and mixed-mode failure of adhesive bonds between composite adherends

A combined experimental and analytical investigation of an adhesively bonded composite joint was conducted to characterize both the static and fatigue beyond growth mechanism under mode 1 and mixed-mode 1 and 2 loadings. Two bonded systems were studied: graphite/epoxy adherends bonded with EC 3445 and FM-300 adhesives. For each bonded system, two specimen types were tested: a double-cantilever-beam specimen for mode 1 loading and a cracked-lapshear specimen for mixed-mode 1 and 2 loading. In all specimens tested, failure occurred in the form of debond growth. Debonding always occurred in a cohesive manner with EC 3445 adhesive. The FM-300 adhesive debonded in a cohesive manner under mixed-mode 1 and 2 loading, but in a cohesive, adhesive, or combined cohesive and adhesive manner under mode 1 loading. Total strain-energy release rate appeared to be the driving parameter for debond growth under static and fatigue loadings.

Mall, S.↗

NASA NTRS1985

On the similarity of the bonding in NiS and NiO

The bonding in NiS is found to be quite similar to that in NiO, having an ionic contribution arising from the donation of the Ni 4s electron to the S atom and a covalent component arising from bonds between the Ni 3d and the S 3p. The one-electron d bonds are found to be of equal strength for NiO and NiS, but the two-electron d bonds are weaker for NiS.

Bauschlicher, C. W., Jr.↗