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At least 181 records · Page 10

Solvent resistant thermoplastic aromatic poly(imidesulfone) and process for preparing same

A process for preparing a thermoplastic poly(imidesulfone) is disclosed. This resulting material has thermoplastic properties which are generally associated with polysulfones but not polyimides, and solvent resistance which is generally associated with polyimides but not polysulfones. This system is processable in the 250 to 350 C range for molding, adhesive and laminating applications. This unique thermoplastic poly(imidesulfone) is obtained by incorporating an aromatic sulfone moiety into the backbone of an aromatic linear polyimide by dissolving a quantity of a 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA) in a solution of 3,3'-diaminodiphenylsulfone and bis(2-methoxyethyl)ether, precipitating the reactant product in water, filtering and drying the recovered poly(amide-acid sulfone) and converting it to the poly(imidesulfone) by heating.

St.clair, T. L.↗

Development of low viscosity alkane-based urethane for connector potting applications

Two series of saturated hydrocarbon-based urethanes were prepared with isophorone diisocyanate and one series with methyl bis (4-cyclohexyl isocyanate). The urethanes with molecular weights as great as 2500 had viscosities low enough and a working life long enough to be used in potting, molding, and coating applications. Specimens were prepared and mechanical properties such as hardness, tensile strength elongation, and tear strength were determined. Thermomechanical properties (glass transition and expansion coefficient) and thermogravimetric properties were determined.

Morris, D. E.↗

Characterization of geometric isomers of Norbornene end-capped imides

Three geometric isomers from the thermal isomerization of methylene-4,4' bis(endo-N-phenylbicyclo/2.2.1/hept-2-ene-5,6-di carboximide) (I) were chromatographically separated and isolated in order to investigate the thermal cure of norbornene end-capped imide oligomers, which display considerable promise for use in various aerospace adhesive and composite applications. Endo-endo (I), endo-exo (II), and exo-exo (III) configurations were assigned to each compound based on the results of NMR spectroscopy. Several chromatographic, spectroscopic, and thermal techniques were then used to characterize these three isomers which serve as model compounds for norbornene end-capped polyimides. It was found that each compound thermally isomerized to an equilibrium mixture of all three compounds prior to cure. It is proposed that these compounds react by different mechanisms in air and nitrogen.

Young, P. R.↗

Phenoxy resins containing pendent ethynyl groups

As part of an effort on tougher/solvent resistant matrix resins for composites, research was directed towards exploring methods to improve the solvent resistance of linear amorphous thermoplastics. Ethyl reactive groups were placed on the ends of oligomers and pendent along the polymer chain and subsequently thermally reacted to provide crosslinking and thus improvement in solvent resistance. This concept is extended to another thermoplastic, a phenoxy resin. A commercially available phenoxy resin (PKHH) was systematically modified by reaction of the pendent hydroxyl groups on the phenoxy resin with various amounts of 4-ethynylbenzoyl chloride. As the pendent ethynyl group content in the phenoxy resin increased, the cured resin exhibited a higher glass transition temperature, better solvent resistance and less flexibility. The solvent resistance was further improved by correcting a low molecular weight diethynyl compound, 2,2-bis(4-ethynylbenzoyloxy-4'-phenyl)propane, with a phenoxy resin containing pendent ethynyl groups.

Hergenrother, P. M.↗

Phosphorus-containing imide resins

Flame-resistant reinforced bodies are disclosed which are composed of reinforcing fibers, filaments or fabrics in a cured body of bis- and tris-imide resins derived from tris(m-aminophenyl) phosphine oxides by reaction with maleic anhydride or its derivatives, or of addition polymers of such imides, including a variant in which a mono-imide is condensed with a dianhydride and the product is treated with a further quantity of maleic anhydride.

Varma, I. K.↗

Low wear partially fluorinated polyimides

Tribological studies were conducted on five different polyimide solid bodies formulated from the diamine 2,2-bis 4-(4-aminophenoxy)phenyl hexafluoropropane (4-BDAF) and the dianhydrides pyromellitic acid (PMDS) and benzophenonetetracarboxylic acid (BTDA). The following polyimides were evaluated 4-BDAF/PMDA, 4-BDAF/BTDA, 4-BDAF/80 mole percent PMDA, 20 mole percent BTDA, 4-BDAF/60 mole percent BTDA. Friction coefficients, polyimide wear rates, polyimide surface morphology and transfer films were evaluated at sliding speeds of 0.31 to 11.6 m/s and at temperatures of 25 C to 300 C. The results indicate that the tribological properties are highly dependent on the composition of the polyimide and on the experimental conditions. Two polyimides were found which produced very low wear rates but very high friction coefficients (greater than 0.85) under ambient conditions. They offer considerable potential for high traction types of application such as brakes.

Fusaro, R. L.↗

Development of partially fluorinated resin apex seals

Partially fluorinated polyimides were prepared and molded in the form of discs and pins for test as potential apex seal materials for advanced rotary combustion engines. The polyimides were formulated from the diamine 2,2-bis 4-(4-aminophenoxy)phenyl hexafluoropropane (4-BDAF) and the dianhydrides of pyromellitic acid (PMDA) and benzophenonetetracarboxylic acid (BTDA). Tribological testing was performed at sliding speeds of 0.31 to 11.6 m/s and at temperatures of from 298K to 573K. It is shown that the carbon fiber filled polyimides, particularly the 80/20 compositions, have an excellent balance of wear/friction at 573K. The unfilled, 80/20 and 60/40 compositions indicate an unusual combination of high friction and low wear which may be advantageous in such applications as brakes and traction drives.

Green, H. E.↗

Preparation and characterization of siloxane-containing thermoplastic polyimides

Copolyimides and homopolyimides of bis(gamma-aminopropyl)tetramethyldisiloxane and 3,3'-diaminobenzophenone have been prepared with benzophenonetetracarboxylic dianhydride. The properties of the copolyimides were compared with those of the homopolyimides to assess the effect of incorporation of siloxane groups in the backbone. Applications of the polymers as adhesives and mouldings are discussed.

Maudgal, S.↗

Polyimides formulated from a partially fluorinated diamine for aerospace tribological applications

Preliminary pribological studies on polyimides formulated from the diamine 2,2-bis 4-(4-aminophenoxy)phenyl hexafluoropane (4-BDAF) indicate that polyimides formulated from this diamine have excellent potential for high temperature tribological applications. The dianhydrides used to make the polyimides were pyromellitic (PMDA) and benzophenonetetracarboxylic acid (BTDA). Friction and wear studies at 25 and 200 C indicate that polyimides formulated using 50 mole percent of the PMDA dianhydride and 50 mole percent of the BTDA dianhydride perform better than polyimides formulated solely with the BTDA dianhydride. Graphite fiber reinforced polyimide composites were formulated with the polyimide made from the BTDA dianhydride and both graphitic and non-graphitic fibers were evaluated. Graphitic fibers produced better tribological results, since thin, flowing, 'layer-like' transfer films were produced which did not build up with long sliding durations. Non-graphitic fibers did not produce this type of transfer. Previously announced in STAR as N83-22423

Fusaro, R. L.↗

Siloxane containing addition polyimides

Addition polyimide oligomers have been synthesized from bis(gamma-aminopropyl) tetramethyldisiloxane and 3, 3', 4, 4'-benzophenonetetracarboxylic dianhydride using a variety of latent crosslinking groups as endcappers. The prepolymers were isolated and characterized for solubility (in amide, chlorinated and ether solvents), melt flow and cure properties. The most promising systems, maleimide and acetylene terminated prepolymers, were selected for detailed study. Graphite cloth reinforced composites were prepared and properties compared with those of graphite/Kerimid 601, a commercially available bismaleimide. Mixtures of the maleimide terminated system with Kerimid 601, in varying proportions, were also studied.

Maudgal, S.↗

Alkane-Based Urethane Potting Compounds

New low viscosity urethanes easily mixed, molded, and outgassed. Alkane-based urethanes resist hydrolysis and oxidation and have excellent dielectric properties. Low-viscosity alkane-based urethane prepolymer prepared by one-step reaction of either isophorone diisocyanate or methyl-bis (4-cyclohexyl isocyanate) with hydrogenated, hydroxy-terminated polybutadiene (HTPBD).

Morris, D. E.↗

Imide modified epoxy matrix resins

The results of a program designed to develop tough imide modified epoxy resins cured by bisimide amine (BIA) hardeners are described. State-of-the-art epoxides MY720 and DER383 were used, and four bismide amines were evaluated. These were the BIA's derived from the 6F anhydride (4,4'-(hexafluoroisopropylidene) bis(phthalic anhydride) and the diamines 3,3'-diaminodiphynyl sulfone, 4,4'-oxygianiline, 4,4'-methylene dianiline, and 1,12-dodecane diamine. A key intermediate, designated 6F anhydride, is required for the synthesis of the bisimide amines. Reaction parameters to synthesize a precursor to the 6F anhydride (6FHC) in high yields were investigated. The catalyst trifluoromethane sulfonic acid was studied. Although small scale runs yielded the 6FHC in 50 percent yield, efforts to ranslate these results to a larger scale synthesis gave the 6FHC in only 9 percent yield. Results show that the concept of using bisimide amine as curing agents to improve the toughness properties of epoxies is valid.

Scola, D. A.↗

Process for preparing solvent resistant, thermoplastic aromatic poly(imidesulfone)

A process for preparing a thermoplastic poly(midesulfone) is disclosed. This resulting material has thermoplastic properties which are generally associated with polysulfones but not polyimides, and solvent resistant which is generally associated with polyimides but not polysulfones. This system is processable in the 250 to 350 C range for molding, adhesive and laminating applications. This unique thermoplastic poly(imidesulfone) is obtained by incorporating an aromatic sulfone moiety into the backbone of an aromatic linear polyimide by dissolving a quantity of a 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA) in a solution of 3,3'-diaminodiphenylsulfone and bis(2-methoxyethyl)ether, precipitating the reactant product in water, filtering and drying the recovered poly(amide-acid sulfone) and converting it to the poly(imidesulfone) by heating.

St.clair, T. L.↗

Phosphorus-containing imide resins

Cured polymers of bis and tris-imides derived from tris(m-aminophenyl) phosphine oxides by reaction with maleic anhydride or its derivatives, and addition polymers of such imides, including a variant in which a monoimide is condensed with a dianhydride and the product is treated with a further quantity of maleic anhydride prior to curing are disclosed and claimed. Such polymers are flame resistant. Also disclosed are an improved method of producing tris(m-aminophenyl) phosphine oxides from the nitro analogues by reduction with hydrazine hydrate using palladized charcoal or Raney nickel as the catalyst and fiber reinforced cured resin composites.

Varma, I. K.↗

An investigation of molecular structure of copolymers using positron annihilation spectroscopy

Positron lifetime measurements were made in copolyimides synthesized from linear 4,4 prime-bis(3,4-dicarboxyphenoxy) diphenylsulfide dianhydride (BDSDA)/4,4 prime-diaminodiphenyl (ODA) and BDSDA/1,3-diaminobenzene (m-phenylene diamine) homopolymers. The probability of positronium formation as well as its subsequent lifetime are lower in the BDSDA/ODA/MPD (50-50) copolyimide, indicating the presence of a transition molecular architecture characterized by higher electron density and stronger bonds which permit both chemical as well as physical entry of water molecules into it. The presence of this transition region imparts unique physical and mechanical properties to the copolyimide.

Singh, J. J.↗

Magnesium doping of efficient GaAs and Ga(0.75)In(0.25)As solar cells grown by metalorganic chemical vapor deposition

Magnesium has been substituted for zinc in GaAs and Ga(0.75)In(0.25)As solar cells grown by metalorganic chemical vapor deposition (MOCVD). Bis(cyclopentadienyl)magnesium (Cp2Mg) is used as the MOCVD transport agent for Mg. Full retention of excellent material quality and efficient cell performance results. The substitution of Mg for Zn would enhance the abruptness and reproducibility of doping profiles, and facilitate high temperature processing and operation, due to the much lower diffusion coefficient of Mg, relative to Zn, in these materials.

Lewis, C. R.↗

Siloxane containing addition polyimides. II - Acetylene terminated polyimides

Acetylene terminated polyimide oligomers having a range of molecular weights have been synthesized by reacting bis (gamma-aminopropyl) tetramethyldisiloxane, aminophenylacetylene and 3, 3', 4, 4' benzophenonetetracarboxylic dianhydride in different molar ratios. The prepolymers were isolated and characterized for melt flow and cure properties. They show promise as adhesives for bonding titanium to titanium and as matrix resins for graphite cloth reinforced composites. The most promising system has been blended in varying proportions with Thermid 600, a commercially available acetylene terminated polyimide oligomer, and the mixtures have been tested for application as composite matrix resins.

Maudgal, S.↗

Preparation and characterization of a siloxane containing bismaleimide

A novel siloxane containing bismaleimide has been prepared by reacting maleic anhydride, benzophenonetetracarboxylic dianhydride and bis(gamma-aminopropyl)tetramethyldisiloxane. Characterization of this monomer was done by comparing its nuclear magnetic resonance spectrum (NMR) to those of model compounds. Solubility of the prepolymer was tested in amide, chlorinated and ether solvents. Films were cast from solution as well as by melt processing and a cure cycle was determined. Infrared spectrum (IR) of the resulting film was obtained. Thermal polymerization was investigated by differential scanning calorimetry (DSC). Thermal properties of the cured resin were followed by means of thermogravimetric analysis (TGA), torsional braid analysis (TBA) and dynamic mechanical analysis (DMA). Thermomechanical analysis (TMA) was used to study the effect of postcure on the glass transition temperature (Tg) of the resin. Adhesive strength of the resin was obtained at ambient temperature.

Maudgal, S.↗