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At least 181 records · Page 10

Branching Ratios for The Radiometric Calibration of EUNIS-2012

The Extreme Ultraviolet Normal Incidence Spectrograph (EUNIS) sounding rocket instrument is a two-channel imaging spectrograph that observes the solar corona and transition region with high spectral resolution and a rapid cadence made possible by unprecedented sensitivity. The upcoming flight will incorporate a new wavelength channel covering the range 524-630 Angstroms, the previously-flown 300-370 Angstroms channel, and the first flight demonstration of cooled active pixel sensor (APS) arrays. The new 524-630 Angstrom channel incorporates a Toroidal Varied Line Space (TVLS) grating coated with B4C/Ir, providing broad spectral coverage and a wide temperature range of 0.025 to 10 MK. Absolute radiometric calibration of the two channels is being performed using a hollow cathode discharge lamp and NIST-calibrated AXUV-100G photodiode. Laboratory observations of He I 584 Angstroms and He II 304 Angstroms provide absolute radiometric calibrations of the two channels at those two respective wavelengths by using the AXUV photodiode as a transfer standard. The spectral responsivity is being determined by observing line pairs with a common upper state in the spectra of Ne I-III and Ar II-III. Calculations of A-values for the observed branching ratios are in progress.

Daw, Adrian N.↗

Total Dose Testing of a CMOS Charged Particle Spectrometer

CMOS Charged Particle Spectrometer chips [1], designated CPS32, have been developed for an experiment on the STRV-2 spacecraft. These chips, which are a form of Active Pixel Sensor (APS), were designed for proton and electron energy spectrometry.

Dose↗

Direction-Sensitive Hand-Held Gamma-Ray Spectrometer

A novel, light-weight, hand-held gamma-ray detector with directional sensitivity is being designed. The detector uses a set of multiple rings around two cylindrical surfaces, which provides precise location of two interaction points on two concentric cylindrical planes, wherefrom the source location can be traced back by back projection and/or Compton imaging technique. The detectors are 2.0 × 2.0 mm europium-doped strontium iodide (SrI2:Eu2+) crystals, whose light output has been measured to exceed 120,000 photons/MeV, making it one of the brightest scintillators in existence. The crystal’s energy resolution, less than 3% at 662 keV, is also excellent, and the response is highly linear over a wide range of gamma-ray energies. The emission of SrI2:Eu2+ is well matched to both photo-multiplier tubes and blue-enhanced silicon photodiodes. The solid-state photomultipliers used in this design (each 2.0 × 2.0 mm) are arrays of active pixel sensors (avalanche photodiodes driven beyond their breakdown voltage in reverse bias); each pixel acts as a binary photon detector, and their summed output is an analog representation of the total photon energy, while the individual pixel accurately defines the point of interaction. A simple back-projection algorithm involving cone-surface mapping is being modeled. The back projection for an event cone is a conical surface defining the possible location of the source. The cone axis is the straight line passing through the first and second interaction points.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Ultra Low Power Imaging Systems Using CMOS Image Sensor Technology

The need for miniaturization in advanced science sensor systems has led to the development of a new image sensor technology, the active pixel image sensor (APS). The development of CMOS APS technology allows the integration of timing and control electronics, imaging detector arrays, signal chains and analog-to-digital conversion on a single integrated circuit. The impact on the imaging system is to reduce power by approximately 1000x over existing systems - from tens of watts to tens of milliwatts.

imaging↗

Micro sun sensor

Explore the source record for details and available documents.

sun sensor MEMS Active pixel sensor↗

Performance of CMOS pixel sensor prototypes in ams H35 and aH18 technology for the ATLAS ITk upgrade

Pixel sensors based on commercial high-voltage CMOS processes are an exciting technology that is considered as an option for the outer layer of the ATLAS inner tracker upgrade at the High Luminosity LHC. Here, charged particles are detected using deep n-wells as sensor diodes with the depleted region extending into the silicon bulk. Both analog and digital readout electronics can be added to achieve different levels of integration up to a fully monolithic sensor. Small scale prototypes using the ams CMOS technology have previously demonstrated that it can achieve the required radiation tolerance of 10(15) n(eq)/cm(2) and detection efficiencies above 99.5%. Recently, large area prototypes, comparable in size to a full sensor, have been produced that include most features required towards a final design: the H35demo prototype produced in ams H35 technology that supports both external and integrated readout and the monolithic ATLASPix1 pre-production design produced in ams aH18 technology. Both chips are based on large fill-factor pixel designs, but differ in readout structure. Performance results for H35DEMO with capacitively-coupled external readout and first results for the monolithic ATLASPix1 are shown.

ATLAS ITk upgrade↗

Active-Pixel Cosmic-Ray Sensor

Cosmic-ray sensor comprises planar rectangular array of lateral bipolar npn floating-base transistors each of which defines pixel. Collector contacts of all transistors in each row connected to same X (column) line conductor; emitter contacts of all transistors in each column connected to same Y (row) line conductor; and current in each row and column line sensed by amplifier, output of which fed to signal-processing circuits.

Fossum, Eric R.↗

Characteristics of Monolithically Integrated InGaAs Active Pixel Imager Array

Switching and amplifying characteristics of a newly developed monolithic InGaAs Active Pixel Imager Array are presented. The sensor array is fabricated from InGaAs material epitaxially deposited on an InP substrate. It consists of an InGaAs photodiode connected to InP depletion-mode junction field effect transistors (JFETs) for low leakage, low power, and fast control of circuit signal amplifying, buffering, selection, and reset. This monolithically integrated active pixel sensor configuration eliminates the need for hybridization with silicon multiplexer. In addition, the configuration allows the sensor to be front illuminated, making it sensitive to visible as well as near infrared signal radiation. Adapting the existing 1.55 micrometer fiber optical communication technology, this integration will be an ideal system of optoelectronic integration for dual band (Visible/IR) applications near room temperature, for use in atmospheric gas sensing in space, and for target identification on earth. In this paper, two different types of small 4 x 1 test arrays will be described. The effectiveness of switching and amplifying circuits will be discussed in terms of circuit effectiveness (leakage, operating frequency, and temperature) in preparation for the second phase demonstration of integrated, two-dimensional monolithic InGaAs active pixel sensor arrays for applications in transportable shipboard surveillance, night vision, and emission spectroscopy.

Kim, Q.↗

Assessment of Image Sensor Technology for Future NASA Missions

An assessment of solid-state UV/visible image sensor technology for future NASA missions is presented. The paper will attempt to summarize the state of the art in image sensor technology in the United States, Canada, Japan, and Europe. The state of the art and future trends will be compared to a forecast of future NASA needs in scientific image sensors for planetary exploration, earth science, astrophysics, and spacecraft systems such as star trackers and optical communications.

solid-state↗

An Algorithm of an X-ray Hit Allocation to a Single Pixel in a Cluster and Its Test-Circuit Implementation

An on-chip implementable algorithm for allocation of an X-ray photon imprint, called a hit, to a single pixel in the presence of charge sharing in a highly segmented pixel detector is described. Its proof-of-principle implementation is also given supported by the results of tests using a highly collimated X-ray photon beam from a synchrotron source. The algorithm handles asynchronous arrivals of X-ray photons. Activation of groups of pixels, comparisons of peak amplitudes of pulses within an active neighborhood and finally latching of the results of these comparisons constitute the three procedural steps of the algorithm. A grouping of pixels to one virtual pixel, that recovers composite signals and event driven strobes, to control comparisons of fractional signals between neighboring pixels are the actuators of the algorithm. The circuitry necessary to implement the algorithm requires an extensive inter-pixel connection grid of analog and digital signals, that are exchanged between pixels. A test-circuit implementation of the algorithm was achieved with a small array of 32 × 32 pixels and the device was exposed to an 8 keV highly collimated to a diameter of 3-μm X-ray beam. Furthermore, the results of these tests are given in this paper assessing physical implementation of the algorithm.

47 OTHER INSTRUMENTATION↗

ALICE-USA Barrel Tracking Upgrade (Project Final Report)

The ALICE-USA Barrel Tracking Upgrade (BTU) project began in 2015 to participate in a major upgrade of the Time Projection Chamber (TPC) and the Inner Tracking System (ITS) of the ALICE Experiment at CERN in Geneva, Switzerland. This upgrade increased the maximum readout rate of the ALICE detector to accommodate the increased heavy ion interaction rates following Long Shutdown 2 of the Large Hadron Collider, and greatly improved the vertexing performance of the detector. The original scope was completed and reviewed in November 2019. The BTU project document BTU.19.v1 "ALICE Barrel Tracking Upgrade Project Closeout / Transition to Operations (2019)" from November 2019 describes the status in detail and is attached as Appendix 1 below. At that point, all delivery milestones had been met on time, all Key Performance Parameters (KPPs) of the project had been satisfied, and the project was under budget. Several subsequent No Cost Extensions (NCEs) supported integration and pre-commissioning of the BTU project deliverables at CERN, as well as study and assessment of performance with Pb-Pb collisions at 50 kHz. The BTU project was successfully completed on 30 September 2024.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗