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DOE OSTI · 3682559

Moisture Durability and Thermal Performance of Retrofitted Wall Systems with Wood Fiber Insulation: An Environmental Chamber Study

Iffa, Emishaw [ORNL]·Desjarlais, Andre [ORNL] (ORCID:0000000186459645)·Salonvaara, Mikael [ORNL] (ORCID:0000000318991554)·Tang, Mengjia [ORNL] (ORCID:0000000267215626)·Smirh, Evan [Highland Park Technologies]·Borger, Christian [Highland Park Technologies]
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Iffa, Emishaw [ORNL], Desjarlais, Andre [ORNL] (ORCID:0000000186459645), Salonvaara, Mikael [ORNL] (ORCID:0000000318991554), Tang, Mengjia [ORNL] (ORCID:0000000267215626), Smirh, Evan [Highland Park Technologies], Borger, Christian [Highland Park Technologies]. 2025-12-01. Moisture Durability and Thermal Performance of Retrofitted Wall Systems with Wood Fiber Insulation: An Environmental Chamber Study. https://www.osti.gov/biblio/3682559

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