DOE OSTI · 3395509
A Coupled Thermal-Mechanical Deep Material Network
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Shin, Dongil [Postech], Robertson, Andreas Euan [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)] (ORCID:0009000032590744), Lebensohn, Ricardo [Los Alamos National Laboratory], Dingreville, Remi Philippe Michel [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)] (ORCID:000000031613695X). 2025-06-01. A Coupled Thermal-Mechanical Deep Material Network. https://doi.org/10.2172/3395509
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