Numerical Thermalization in 3D PIC Plasma Simulations

Park, Ryan [University of Michigan]; Moore, Christopher Hudson [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)] (ORCID:000000026940675X); Baalrud, Scott [University of Michigan]

doi:10.2172/3378028

DOE OSTI · 3378028

Numerical Thermalization in 3D PIC Plasma Simulations

Park, Ryan [University of Michigan]·Moore, Christopher Hudson [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)] (ORCID:000000026940675X)·Baalrud, Scott [University of Michigan]

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Park, Ryan [University of Michigan], Moore, Christopher Hudson [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)] (ORCID:000000026940675X), Baalrud, Scott [University of Michigan]. 2025-07-01. Numerical Thermalization in 3D PIC Plasma Simulations. https://doi.org/10.2172/3378028

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