Dynamics of the water-plasma interface in various discharge modes of atmospheric-pressure plasmas

Abstract

This paper presents an experimental study of the dynamics of the water-plasma interface during the interaction high-voltage (HV) atmospheric pressure discharge with the water surface. Under the influence of the voltage applied to the pin type electrode, discharges are formed at the air layer between the sharp-tip HV electrode and deionized water. Three discharge regimes were identified from synchronized electrical waveforms and imaging: (i) a weak linear regime at 3–10.6 kV, (ii) a branching streamer regime at the maximum applied voltage of 12.6 kV, and (iii) a continuous arc-like regime occurring during the transition to lower voltage and higher current (e.g., U ≈ 3.2 kV, I ≈ 4.07 mA). High-speed shadowgraph images showed a symmetric interfacial cavity whose depth increased nonlinearly with voltage from h 0 ≈ 0.1 mm at 3 kV to h 0 ≈ 2.7 mm at 10.6 kV, reaching a maximum depth of h 0 ≈ 5.9 mm at 12.6 kV, while the cavity disappeared in the continuous-channel regime and was replaced by outward-propagating wave-like motion. The deformation of the water surface during the discharge-water interaction is governed by the balance between electric field forces, surface tension, gravitational forces, and electrohydrodynamic forces, whose relative contributions vary with the applied voltage. This effect was explained by quantitatively estimating the magnitudes of the acting forces and establishing the force balance. Optical emission spectroscopy in the continuous-channel regime indicated air plasma signatures and yielded a gas temperature of approximately 400 K, while prolonged operation (≈ 20 min) increased the water temperature to ~ 70 °C, reduced the water-layer thickness from 6 mm to 3 mm, and decreased pH from 7 to 4. These regime-resolved, quantitative results clarify how the dominant interfacial forcing shifts with discharge mode and provide a mechanistic basis for controlling plasma-water interactions in atmospheric-pressure applications.