DOE OSTI · 3022361
Rapid Prototyping Techniques for Organic Direct-Bonded-Copper Power Modules
Abstract
Organic Direct-Bonded-Copper (ODBC) is a novel packaging technology for power modules which allows higher flexibility in layout design. In this work, a set of rapid prototyping techniques are developed for ODBC modules based on a polyimide dielectric material. These techniques enable fast and low-cost fabrication of modules with 3-Dimensional (3D) layout features. An example half-bridge (HB) silicon carbide (SiC) metal oxide semiconductor field effect transistor (MOSFET) module is designed and prototyped using the proposed techniques aiming at ultra-low power loop inductance. Finite element analysis (FEA)-circuit co-simulations results and experimental results validate an approximately 0.71nH power loop inductance for the example module design.
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Zhao, Shuofeng [National Laboratory of the Rockies, Golden, CO (United States)] (ORCID:0000000208021979), Major, Joshua [National Laboratory of the Rockies, Golden, CO (United States)] (ORCID:0000000194240643), DeVoto, Douglas [National Laboratory of the Rockies, Golden, CO (United States)] (ORCID:0000000348179647), Khan, Faisal [National Laboratory of the Rockies, Golden, CO (United States)] (ORCID:0009000000229954), Narumanchi, Sreekant [National Laboratory of the Rockies, Golden, CO (United States)] (ORCID:0000000153376069). 2025-09-29. Rapid Prototyping Techniques for Organic Direct-Bonded-Copper Power Modules. https://doi.org/10.1109/3d-peim64703.2025.11180279
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