DOE OSTI · 2587781
Development of a conduction-based model for analyzing frozen startup of alkali-metal heat pipes
Abstract
One key area of interest in heat pipe modeling/simulation is to analyze the startup behavior of the liquid-metal heat pipes (LMHPs) from a frozen state. This so-called ‘frozen startup’ process involves a complex set of nonlinear mass and heat transport phenomena, including phase transitions from solid to liquid and vapor, multiphase interactions, microporous wick flow, and compressible vapor dynamics. The complexity of these processes makes it challenging to simulate LMHP’s frozen startup using conventional numerical methods or commercial computational fluid dynamics (CFD) software. This paper presents a simplified conduction-based modeling approach that can provide practical insights into the entire LMHP frozen startup process, while alleviating the challenges of modeling its complex physics. The theoretical foundation and physical assumptions of the proposed model are based solely on heat-conduction equation, allowing for a more tractable simulation without sacrificing essential physical accuracy. The proposed model was implemented in a commercial CFD software, and its prediction was compared with the experimental data obtained from sodium heat-pipe startup experiments. The comparison highlights the proposed model's ability to capture the transient thermal behavior of LMHP during frozen startup. This study not only validates the conduction-based frozen startup modeling method but also shows its potential as a practical and efficient tool for understanding the startup performance of the LMHP systems.
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Yoo, JunSoo [Idaho National Laboratory (INL), Idaho Falls, ID (United States)] (ORCID:0000000339233701), Song, Minseop [Hanyang University, Seoul (Korea, Republic of)], Qin, Sunming [Idaho National Laboratory (INL), Idaho Falls, ID (United States)] (ORCID:0000000228500387). 2025-07-09. Development of a conduction-based model for analyzing frozen startup of alkali-metal heat pipes. https://doi.org/10.1016/j.applthermaleng.2025.127475
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