DOE OSTI · 2513912
A Printed Microscopic Universal Gradient Interface for Super Stretchable Strain‐Insensitive Bioelectronics
Abstract
Abstract Stretchable electronics capable of conforming to nonplanar and dynamic human body surfaces are central for creating implantable and on‐skin devices for high‐fidelity monitoring of diverse physiological signals. While various strategies have been developed to produce stretchable devices, the signals collected from such devices are often highly sensitive to local strain, resulting in inevitable convolution with surface strain‐induced motion artifacts that are difficult to distinguish from intrinsic physiological signals. Here all‐printed super stretchable strain‐insensitive bioelectronics using a unique universal gradient interface (UGI) are reported to bridge the gap between soft biomaterials and stiff electronic materials. Leveraging a versatile aerosol‐based multi‐materials printing technique that allows precise spatial control over the local stiffnesses with submicron resolution, the UGI enables strain‐insensitive electronic devices with negligible resistivity changes under a 180% uniaxial stretch ratio. Various stretchable devices are directly printed on the UGI for on‐skin health monitoring with high signal quality and near‐perfect immunity to motion artifacts, including semiconductor‐based photodetectors for sensing blood oxygen saturation levels and metal‐based temperature sensors. The concept in this work will significantly simplify the fabrication and accelerate the development of a broad range of wearable and implantable bioelectronics for real‐time health monitoring and personalized therapeutics.
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Song, Kaidong [Department of Aerospace and Mechanical Engineering University of Notre Dame Notre Dame IN 46556 USA], Zhou, Jingyuan [Chemistry and Biochemistry Department University of California Los Angeles Los Angeles CA 90095 USA], Wei, Chen [Department of Mechanical and Aerospace Engineering University of California Los Angeles Los Angeles CA 90095 USA], Ponnuchamy, Ashok [Department of Electrical Engineering University of Notre Dame Notre Dame IN 46556 USA], Bappy, Md Omarsany [Department of Aerospace and Mechanical Engineering University of Notre Dame Notre Dame IN 46556 USA], Liao, Yuxuan [Department of Aerospace and Mechanical Engineering University of Notre Dame Notre Dame IN 46556 USA], Jiang, Qiang [Department of Aerospace and Mechanical Engineering University of Notre Dame Notre Dame IN 46556 USA], Du, Yipu [Department of Aerospace and Mechanical Engineering University of Notre Dame Notre Dame IN 46556 USA], Evans, Connor J. [Department of Aerospace and Mechanical Engineering University of Notre Dame Notre Dame IN 46556 USA], Wyatt, Brian C. [School of Materials Engineering Purdue University West Lafayette IN 47907 USA], O’ Sullivan, Thomas [Department of Electrical Engineering University of Notre Dame Notre Dame IN 46556 USA], Roeder, Ryan K. [Department of Aerospace and Mechanical Engineering University of Notre Dame Notre Dame IN 46556 USA], Anasori, Babak [School of Materials Engineering Purdue University West Lafayette IN 47907 USA], Hoffman, Anthony J. [Department of Electrical Engineering University of Notre Dame Notre Dame IN 46556 USA], Jin, Lihua [Department of Mechanical and Aerospace Engineering University of California Los Angeles Los Angeles CA 90095 USA], Duan, Xiangfeng [Chemistry and Biochemistry Department University of California Los Angeles Los Angeles CA 90095 USA], Zhang, Yanliang [Department of Aerospace and Mechanical Engineering University of Notre Dame Notre Dame IN 46556 USA] (ORCID:0000000174238001). 2025-02-09. A Printed Microscopic Universal Gradient Interface for Super Stretchable Strain‐Insensitive Bioelectronics. https://doi.org/10.1002/adma.202414203
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