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DOE OSTI · 2506998

Influence of implantation temperature and He implantation-induced defects on morphological evolution of co-deposited Cu-Mo nanocomposites

Abstract

Here, we investigate the effect of high-temperature helium (He) implantation on microstructural evolution in physical-vapor-co-deposited nanocomposite thin films of copper (Cu) and molybdenum (Mo). The microstructure morphologies of He-implanted and He-free domains are characterized using transmission electron microscopy and statistical analysis. High implantation temperatures (500°C and 750°C) lead to coarsening of Cu and Mo domains and their eventual reorientation. The microstructure evolution in He-implanted and He-free domains is comparable, indicating that implantation-induced defects do not accelerate the coarsening of the nanocomposite as compared to annealing alone. This observation contrasts with previously reported effects of implantation-induced defects on single-phase nanocrystalline metals, which include enhancement of grain growth by increasing self-diffusivity or its inhibition by pinning of grain boundaries.

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BibTeXRIS

Yadav, Digvijay [Texas A & M Univ., College Station, TX (United States)], Derby, Benjamin K. [Los Alamos National Laboratory (LANL), Los Alamos, NM (United States). Center for Integrated Nanotechnologies (CINT)], Powers, Max [Univ. of Michigan, Ann Arbor, MI (United States)], Baldwin, Jon Kevin [Los Alamos National Laboratory (LANL), Los Alamos, NM (United States). Center for Integrated Nanotechnologies (CINT)], Wang, Yongqiang [Los Alamos National Laboratory (LANL), Los Alamos, NM (United States)], Misra, Amit [Univ. of Michigan, Ann Arbor, MI (United States)], Xie, Kelvin Y. [Texas A & M Univ., College Station, TX (United States)], Demkowicz, Michael J. [Texas A & M Univ., College Station, TX (United States)]. 2025-01-18. Influence of implantation temperature and He implantation-induced defects on morphological evolution of co-deposited Cu-Mo nanocomposites. https://doi.org/10.1016/j.jnucmat.2025.155645

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36 MATERIALS SCIENCE