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DOE OSTI · 2447370

DE‐SC0021477- PHASE II FINAL REPORT

Abbaspour, Reza

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3D microelectronics, interconnection, NP detectors, pixelated silicon strip, electronic packaging, 3D integration, 3D printing, flexible interconnection

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Abbaspour, Reza. 2024-07-05. DE‐SC0021477- PHASE II FINAL REPORT. https://www.osti.gov/biblio/2447370

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