NASA NTRS · 20210011656
NASA and FMI - Developing Enabling TPS
Abstract
PICA and HEEET/3MDCP are proven and capable TPS solutions that are needed for the majority of future SMD-PSD missions. FMI has been a critical partner in the development of both PICA and HEEET as FMI's manufacturing capabilities are essential for the large-scale processing of PICA, HEEET and 3MDCP TPS materials in support of countless past and future NASA missions acrosss the solar system.
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Matthew J Gasch. NASA and FMI - Developing Enabling TPS. https://ntrs.nasa.gov/citations/20210011656
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