NASA NTRS · 20130012849
NASA-DoD Lead-Free Electronics Project
Abstract
The primary technical objective of this project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: (1) Packages (e.g., Thin Small Outline Package [TSOP], Ball Grid Array [BGA], Plastic Dual In-line Package [PDIP]) assembled and reworked with lead-free alloys, (2) Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with mixed (lead/lead-free) alloys.
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Kessel, Kurt R.. 2009-10-05. NASA-DoD Lead-Free Electronics Project. https://ntrs.nasa.gov/citations/20130012849
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