Differential temperature stress measurement employing array sensor with local offset

Abstract

The instrument has a focal plane array of infrared sensors of the integrating type such as a multiplexed device in which a charge is built up on a capacitor which is proportional to the total number of photons which that sensor is exposed to between read-out cycles. The infrared sensors of the array are manufactured as part of an overall array which is part of a micro-electronic device. The sensor achieves greater sensitivity by applying a local offset to the output of each sensor before it is converted into a digital word. The offset which is applied to each sensor will typically be the sensor's average value so that the digital signal which is periodically read from each sensor of the array corresponds to the portion of the signal which is varying in time. With proper synchronization between the cyclical loading of the test object and the frame rate of the infrared array the output of the A/D converted signal will correspond to the stress field induced temperature variations. A digital lock-in operation may be performed on the output of each sensor in the array. This results in a test instrument which can rapidly form a precise image of the thermoelastic stresses in an object.