QTGA Analysis with Concurrent Deposition

Abstract

Analysis of outgassed species behavior is often performed using QCM thermogravimetric analysis (QTGA). Prior methods are suited to laboratory testing of materials samples where the source of contaminant can be removed from the system. An approach suitable presented for use during hardware bakeout and outgassing certification is presented. An iterative process is shown to fit surface activation energies and the arrival flux for multiple species.