Thermal Effects Modeling Developed for Smart Structures

Abstract

Applying smart materials in aeropropulsion systems may improve the performance of aircraft engines through a variety of vibration, noise, and shape-control applications. To facilitate the experimental characterization of these smart structures, researchers have been focusing on developing analytical models to account for the coupled mechanical, electrical, and thermal response of these materials. One focus of current research efforts has been directed toward incorporating a comprehensive thermal analysis modeling capability. Typically, temperature affects the behavior of smart materials by three distinct mechanisms: Induction of thermal strains because of coefficient of thermal expansion mismatch 1. Pyroelectric effects on the piezoelectric elements; 2. Temperature-dependent changes in material properties; and 3. Previous analytical models only investigated the first two thermal effects mechanisms. However, since the material properties of piezoelectric materials generally vary greatly with temperature (see the graph), incorporating temperature-dependent material properties will significantly affect the structural deflections, sensory voltages, and stresses. Thus, the current analytical model captures thermal effects arising from all three mechanisms through thermopiezoelectric constitutive equations. These constitutive equations were incorporated into a layerwise laminate theory with the inherent capability to model both the active and sensory response of smart structures in thermal environments. Corresponding finite element equations were formulated and implemented for both the beam and plate elements to provide a comprehensive thermal effects modeling capability.