NASA NTRS · 19870000246
Ensuring Fully Soldered Through Holes
Abstract
Simple differential-pressure soldering method provides visual evidence that hidden joints are fully soldered. Intended for soldering connector pins in plated through holes in circuit boards. Molten solder flows into plated through holes, drawn by vacuum in manifold over circuit board. Differential-pressure process ensures solder wets entire through hole around connector pin.
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Blow, Raymond K.. 1987-05-01. Ensuring Fully Soldered Through Holes. https://ntrs.nasa.gov/citations/19870000246
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