NASA NTRS · 19850013340
Ingot slicing machine and method
Abstract
An improved method for simultaneously slicing one or a multiplicity of boules of silicon into silicon wafers is described. A plurality of vertical stacks of horizontal saw blades of circular configuration are arranged in juxtaposed coaxial alignment. Each blade is characterized by having a cutting diameter slightly greater than the cutting diameter of the blade arranged immediately above, imparting a simultaneous rotation to the blades.
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Kuo, Y. S.. 1984-10-09. Ingot slicing machine and method. https://ntrs.nasa.gov/citations/19850013340
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