Metalization Patterns by Thermal Decomposition

Abstract

Metal interconnection pattern deposited on integrated circuit or solar cell economically by thermal decomposition of metallo-organic compound. In proposed process beam from laser or quartz lamp swept over substrate in required metalization pattern; wherever beam impinges on substrate, radiant heat decomposes compound, depositing metal. Process requires less costly equipment and less time than conventional metalization. Process readily adaptable to very-large-scale integrated (VLSI) circuits.