Stress studies in EFG

Abstract

A computer code which can account for plastic deformation effects on stress generated in silicon sheet grown at high speeds is fully operative. Stress and strain rate distributions are presented for two different sheet temperature profiles. The calculations show that residual stress levels are very sensitive to details of the cooling profile in a sheet with creep. Experimental work has been started in several areas to improve understanding of ribbon temperature profiles and stress distributions associated with a 10 cm wide ribbon cartridge system.