NASA NTRS · 19790022136
NR-150 adhesive development
Abstract
A polyimide precursor adhesive solution, code-named NR-056X, was developed. It reproducibly gives low void, high strength bond lines at both room temperature and 589K (600 F) using either titanium or graphite/polyimide composite adherends having 12.7 mm (1/2 in.) overlaps. Lap shear samples prepared using this adhesive and composite adherends based on graphite/NR-150B2 were shown to have a high degree of resistance to such adverse environments as air at 589K (600 F), high humidity, methyl ethyl ketone and jet fuel. Bond line toughness was illustrated by the complete resistance to cracking in the wedge-crack propagation test. The available evidence indicates that wide area composite to composite or composite to metal bonding should be feasible.
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Blatz, P. S., Gibbs, H. H.. 1979-08-01. NR-150 adhesive development. https://ntrs.nasa.gov/citations/19790022136
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