NASA NTRS · 19780000435
No-warp potted circuits
Abstract
Sponge inserts compensate for potting-compound expansion and relieve thermal stresses on circuit boards. Technique quality of production runs on PC boards intended for applications in environments less severe than those for aerospace equipment. Pads reduce weight of modules because they weigh far less than potting compound they displace.
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Robinson, W. W.. 1979-01-01. No-warp potted circuits. https://ntrs.nasa.gov/citations/19780000435
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