Heat transfer device

Abstract

An improved heat transfer device particularly suited for use as an evaporator plate in a diffusion cloud chamber. The device is characterized by a pair of mutually spaced heat transfer plates, each being of a planar configuration, having a pair of opposed surfaces defining therebetween a heat pipe chamber. Within the heat pipe chamber, in contiguous relation with the pair of opposed surfaces, there is disposed a pair of heat pipe wicks supported in a mutually spaced relationship by a foraminous spacer of a planar configuration. A wick including a foraminous layer is contiguously related to the external surfaces of the heat transfer plates for uniformly wetting these surfaces.