Scanning nozzle plating system

Abstract

A plating system is described in which a substrate to be plated is supported on a stationary platform. A nozzle assembly with a small nozzle is supplied with a plating solution under high pressure, so that a constant-flow stream of solution is directed to the substrate. The nozzle assembly is moved relative to the substrate at a selected rate and movement pattern. A potential difference (voltage) is provided between the substrate and the solution in the assembly. The voltage amplitude is modulated so that only when the amplitude is above a minimum known value plating takes place.