@misc{indiciae8151ae37a1d6,
  title = {Ultra-low thermal resistance and pressure drop copper and copper-tungsten diamond-shaped pin fin cold plates for liquid cooling of electronics},
  author = {Pinkus, Ilan [Univ. of Illinois at Urbana-Champaign, IL (United States)] (ORCID:0009000206784363) and Park, Woo Young [Univ. of Illinois at Urbana-Champaign, IL (United States)] (ORCID:0009000016629821) and Ganesan, Vishwanath [Univ. of Illinois at Urbana-Champaign, IL (United States)] (ORCID:0000000181304476) and Zaki, Omar M. [Univ. of Illinois at Urbana-Champaign, IL (United States)] (ORCID:0000000340517226) and Aguirre, Trevor G. [Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)] (ORCID:0000000281469630) and Nawaz, Kashif [Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)] and Miljkovic, Nenad [Univ. of Illinois at Urbana-Champaign, IL (United States); Kyushu Univ., Fukuoka (Japan)] (ORCID:0000000208663680) and King, William P. [Univ. of Illinois at Urbana-Champaign, IL (United States)] (ORCID:0000000186061290)},
  year = {2026},
  doi = {10.1016/j.ijheatmasstransfer.2025.128080},
  url = {https://www.osti.gov/biblio/3375134},
  note = {Source identifier: 3375134}
}