TY  - RPRT
TI  - Adhesively Bonded Copper and Polyimide for Flexible Printed Circuit Boards: A Data-Driven Degradation Study Under Accelerated Aging
AU  - Jo, Yea Jin [Case Western Reserve Univ., Cleveland, OH (United States)]
AU  - Lininger, Andrew [Case Western Reserve Univ., Cleveland, OH (United States)] (ORCID:0000000164017301)
AU  - Gezelter, Jonah [Case Western Reserve Univ., Cleveland, OH (United States)] (ORCID:0000000235213335)
AU  - Lin, Ravi A. [Case Western Reserve Univ., Cleveland, OH (United States)]
AU  - Tran, Quynh D. [Case Western Reserve Univ., Cleveland, OH (United States)] (ORCID:0009000640251834)
AU  - Gee, Richard Hayes [Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)]
AU  - Bora, Mihail [Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)]
AU  - Martin, Ina T. [Case Western Reserve Univ., Cleveland, OH (United States)] (ORCID:0000000194523299)
AU  - Bruckman, Laura S. [Case Western Reserve Univ., Cleveland, OH (United States)]
PY  - 2025
DO  - 10.1021/acsaelm.5c01780
UR  - https://www.osti.gov/biblio/3014263
ID  - 3014263
ER  -