@misc{indiciae9f61bc84e586,
  title = {Adhesively Bonded Copper and Polyimide for Flexible Printed Circuit Boards: A Data-Driven Degradation Study Under Accelerated Aging},
  author = {Jo, Yea Jin [Case Western Reserve Univ., Cleveland, OH (United States)] and Lininger, Andrew [Case Western Reserve Univ., Cleveland, OH (United States)] (ORCID:0000000164017301) and Gezelter, Jonah [Case Western Reserve Univ., Cleveland, OH (United States)] (ORCID:0000000235213335) and Lin, Ravi A. [Case Western Reserve Univ., Cleveland, OH (United States)] and Tran, Quynh D. [Case Western Reserve Univ., Cleveland, OH (United States)] (ORCID:0009000640251834) and Gee, Richard Hayes [Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)] and Bora, Mihail [Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)] and Martin, Ina T. [Case Western Reserve Univ., Cleveland, OH (United States)] (ORCID:0000000194523299) and Bruckman, Laura S. [Case Western Reserve Univ., Cleveland, OH (United States)]},
  year = {2025},
  doi = {10.1021/acsaelm.5c01780},
  url = {https://www.osti.gov/biblio/3014263},
  note = {Source identifier: 3014263}
}