@misc{indiciae80102e065939,
  title = {Semiconductor-compatible topological digital alloys},
  author = {Liang, Yunfan [Rensselaer Polytechnic Institute, Troy, NY (United States)] and West, Damien [Rensselaer Polytechnic Institute, Troy, NY (United States)] and Chen, Shunda [George Washington University, Washington, DC (United States)] and Liu, Jifeng [Dartmouth College, Hanover, NH (United States)] and Li, Tianshu [George Washington University, Washington, DC (United States)] and Zhang, Shengbai [Rensselaer Polytechnic Institute, Troy, NY (United States)]},
  year = {2025},
  doi = {10.1016/j.mattod.2025.03.017},
  url = {https://www.osti.gov/biblio/3001339},
  note = {Source identifier: 3001339}
}