@misc{indiciae0407026bf2a3,
  title = {Microbead Encapsulation for Protection of Electronic Components},
  author = {Hill, Jeffrey R. [Brigham Young Univ., Provo, UT (United States)] (ORCID:0000000184270494) and Chen, Alex [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)] and Wilson, Natasha Jensen [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)] and Boll, Cayden [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)] and O’Bannon, MeiLi [Brigham Young Univ., Provo, UT (United States)] and Trentman, Dallan [Brigham Young Univ., Provo, UT (United States)]},
  year = {2025},
  doi = {10.1115/1.4067650},
  url = {https://www.osti.gov/biblio/2520596},
  note = {Source identifier: 2520596}
}