@misc{indiciae30b05e882c64,
  title = {Fine-grained Ti-Cu microstructures by solid state thermal cycling},
  author = {Saville, Alec I. and Hesmondhalgh, Oliver W. and Compton, Natalie A. and Thompson, Gabriel A. and Sanders, Michael (ORCID:0000000163665219) and Klemm-Toole, Jonah (ORCID:000000031456431X) and Clarke, Kester D. and Fraser, Hamish L. and Kaufman, Michael J. and Karma, Alain and Clarke, Amy J.},
  year = {2023},
  doi = {10.1016/j.addma.2023.103747},
  url = {https://www.osti.gov/biblio/2421655},
  note = {Source identifier: 2421655}
}