TY  - RPRT
TI  - Die Attach Epoxy Characterization for Electronic Assemblies.
AU  - Hagen, Deborah
AU  - Dickens, Sara
AU  - Fowler, James
AU  - Dimke, Mark
PY  - 2022
DO  - 10.2172/2005867
UR  - https://www.osti.gov/biblio/2005867
ID  - 2005867
ER  -