@misc{indiciaed42f5ca89270,
  title = {Fiber-optic sensor packaging assessment and benchmarking for embedded sensing applications},
  author = {Karki, Dolendra and Smith, Christopher B. and Damian, Joseph John C. and Denslow, Kayte M. and Grant, Glenn J. and Lee, Jung-Kun and Ohodnicki, Paul},
  year = {2022},
  doi = {10.1117/12.2618492},
  url = {https://www.osti.gov/biblio/1888304},
  note = {Source identifier: 1888304}
}