Engineering topics
Publications and source records attributed to Zulueta, P. J..
The functionality of spacecraft electronics must be maintained in the harsh environments found in space. The radiation environments can consist of either low-energy x-rays at the surface of the spacecraft or high-energy electrons, high-energy protons and high-energy photons withn the spacecraft.
Report discusses mathematical models used to estimate costs of developing and fabricating microcircuits. Second part discusses LSI packaging using tape chip carrier technology.
Mathematical cost models previously developed for hybrid microelectronic subsystems were refined and expanded. Rework terms related to substrate fabrication, nonrecurring developmental and manufacturing operations, and prototype production are included. Sample computer programs were written to demonstrate hybrid microelectric applications of these cost models. Computer programs were generated to calculate and analyze values for the total microelectronics costs. Large scale integrated (LST) chips utilizing tape chip carrier technology were studied. The feasibility of interconnecting arrays of LSU chips utilizing tape chip carrier and semiautomatic wire bonding technology was demonstrated.
Mathematical cost factors were generated for both hybrid microcircuit and printed wiring board packaging methods. A mathematical cost model was created for analysis of microcircuit fabrication costs. The costing factors were refined and reduced to formulae for computerization. Efficient methods were investigated for low cost packaging of LSI devices as a function of density and reliability. Technical problem areas such as wafer bumping, inner/outer leading bonding, testing on tape, and tape processing, were investigated.