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Wohlgemuth, John H.

Publications and source records attributed to Wohlgemuth, John H..

Photovoltaic failure and degradation modes

The extensive photovoltaic field reliability literature was analyzed and reviewed. Future work is prioritized based upon information assembled from recent installations, and inconsistencies in degradation mode identification are discussed to help guide future publication on this subject. Reported failure rates of photovoltaic modules fall mostly in the range of other consumer products; however, the long expected useful life of modules may not allow for direct comparison. In general, degradation percentages are reported to decrease appreciably in newer installations that are deployed after the year 2000. However, these trends may be convoluted with varying manufacturing and installation quality world-wide. Modules in hot and humid climates show considerably higher degradation modes than those in desert and moderate climates, which warrants further investigation. Delamination and diode/j-box issues are also more frequent in hot and humid climates than in other climates. The highest concerns of systems installed in the last 10 years appear to be hot spots followed by internal circuitry discoloration. Encapsulant discoloration was the most common degradation mode, particularly in older systems. In newer systems, encapsulant discoloration appears in hotter climates, but to a lesser degree. Lastly, thin-film degradation modes are dominated by glass breakage and absorber corrosion, although the breadth of information for thin-film modules is much smaller than for x-Si.

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Degradation in PV Encapsulant Strength of Attachment: An Interlaboratory Study Towards a Climate-Specific Test

Reduced strength of attachment of the encapsulant resulting from the outdoor environment, including ultraviolet (UV) radiation, may decrease photovoltaic (PV) module lifetime by enabling widespread corrosion of internal components. To date, few studies exist showing how the adhesion of PV components varies with environmental stress. We have conducted an interlaboratory experiment to provide an understanding that will be used to develop climatic specific module tests. Factors examined in the study included the UV light source (lamp type), temperature, and humidity to be proposed for use in accelerated aging tests. A poly (ethylene-co-vinyl acetate) (EVA) formulation often used in veteran PV installations was studied using a compressive shear test - to quantify the strength of attachment at the EVA/glass interface. Replicate laminated glass/polymer/glass coupon specimens were weathered at 12 institutions using a variety of indoor chambers or field aging. Shear strength, shear strain, and toughness were measured using a mechanical load-frame for the compressive shear test, with subsequent optical imaging and electron microscopy of the separated surfaces.

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Assessing the Causes of Encapsulant Delamination in PV Modules

Delamination of the encapsulant is one of the most prevalent PV module field failures. This paper will present examples of various types of delaminations that have been observed in the field. It will then discuss the development of accelerated stress tests designed to duplicate those field failures and thus provide tools for avoiding them in the future.

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Multi angle laser light scattering evaluation of field exposed thermoplastic photovoltaic encapsulant materials

Abstract As creep of polymeric materials is potentially a safety concern for photovoltaic modules, the potential for module creep has become a significant topic of discussion in the development of IEC 61730 and IEC 61215. To investigate the possibility of creep, modules were constructed, using several thermoplastic encapsulant materials, into thin‐film mock modules and deployed in Mesa, Arizona. The materials examined included poly(ethylene)‐co‐vinyl acetate (EVA, including formulations both cross‐linked and with no curing agent), polyethylene/polyoctene copolymer (PO), poly(dimethylsiloxane) (PDMS), polyvinyl butyral (PVB), and thermoplastic polyurethane (TPU). The absence of creep in this experiment is attributable to several factors of which the most notable one was the unexpected cross‐linking of an EVA formulation without a cross‐linking agent. It was also found that some materials experienced both chain scission and cross‐linking reactions, sometimes with a significant dependence on location within a module. The TPU and EVA samples were found to degrade with cross‐linking reactions dominating over chain scission. In contrast, the PO materials degraded with chain scission dominating over cross‐linking reactions. Although we found no significant indications that viscous creep is likely to occur in fielded modules capable of passing the qualification tests, we note that one should consider how a polymer degrades, chain scission or cross‐linking, in assessing the suitability of a thermoplastic polymer in terrestrial photovoltaic applications.

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Field testing of thermoplastic encapsulants in high‐temperature installations

Abstract Recently there has been increased interest in using thermoplastic encapsulant materials in photovoltaic modules, but concerns have been raised about whether these would be mechanically stable at high temperatures in the field. Recently, this has become a significant topic of discussion in the development of IEC 61730 and IEC 61215. We constructed eight pairs of crystalline‐silicon modules and eight pairs of glass/encapsulation/glass thin‐film mock modules using different encapsulant materials, of which only two were formulated to chemically crosslink. One module set was exposed outdoors with thermal insulation on the back side in Mesa, Arizona, in the summer (hot‐dry), and an identical module set was exposed in environmental chambers. High‐precision creep measurements (±20 μ m) and electrical performance measurements indicate that despite many of these polymeric materials operating in the melt or rubbery state during outdoor deployment, no significant creep was seen because of their high viscosity, lower operating temperature at the edges, and/or the formation of chemical crosslinks in many of the encapsulants with age despite the absence of a crosslinking agent. Only an ethylene‐vinyl acetate ( EVA ) encapsulant formulated without a peroxide crosslinking agent crept significantly. In the case of the crystalline‐silicon modules, the physical restraint of the backsheet reduced creep further and was not detectable even for the EVA without peroxide. Because of the propensity of some polymeric materials to crosslink as they age, typical thermoplastic encapsulants would be unlikely to result in creep in the vast majority of installations.

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Degradation in PV Encapsulation Transmittance: An Interlaboratory Study Towards a Climate-Specific Test: Preprint

Reduced optical transmittance of encapsulants resulting from ultraviolet (UV) degradation has frequently been identified as a cause of decreased PV module performance through the life of service in the field. The present module safety and qualification standards, however, apply short UV doses only capable of examining design robustness or 'infant mortality' failures. Essential information that might be used to screen encapsulation through product lifetime remains unknown. For example, the relative efficacy of xenon-arc and UVA-340 fluorescent sources or the typical range of activation energy for degradation is not quantified. We have conducted an interlaboratory experiment to provide the understanding that will be used towards developing a climate- and configuration-specific (UV) weathering test. Five representative, known formulations of EVA were studied in addition to one TPU material. Replicate laminated silica/polymer/silica specimens are being examined at 14 institutions using a variety of indoor chambers (including Xenon, UVA-340, and metal-halide light sources) or field aging. The solar-weighted transmittance, yellowness index, and the UV cut-off wavelength, determined from the measured hemispherical transmittance, are examined to provide understanding and guidance for the UV light source (lamp type) and temperature used in accelerated UV aging tests.

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Examination of an optical transmittance test for photovoltaic encapsulation materials

The optical transmittance of encapsulation materials is a key characteristic for their use in photovoltaic (PV) modules. Changes in transmittance with time in the field affect module performance, which may impact product warranties. Transmittance is important in product development, module manufacturing, and field power production (both immediate and long-term). Therefore, an international standard (IEC 62788-1-4) has recently been proposed by the Encapsulation Task-Group within the Working Group 2 (WG2) of the International Electrotechnical Commission (IEC) Technical Committee 82 (TC82) for the quantification of the optical performance of PV encapsulation materials. Existing standards, such as ASTM E903, are general and more appropriately applied to concentrated solar power than to PV. Starting from the optical transmittance measurement, the solar-weighted transmittance of photon irradiance, yellowness index (which may be used in aging studies to assess durability), and ultraviolet (UV) cut-off wavelength may all be determined using the proposed standard. The details of the proposed test are described. The results of a round-robin experiment (for five materials) conducted at seven laboratories to validate the test procedure using representative materials are also presented. For example, the Encapsulation Group actively explored the measurement requirements (wavelength range and resolution), the requirements for the spectrophotometer (including the integrating sphere and instrument accessories, such as a depolarizer), specimen requirements (choice of glass-superstrate and -substrate), and data analysis (relative to the light that may be used in the PV application). The round-robin experiment identified both intra- and inter-laboratory instrument precision and bias for five encapsulation materials (encompassing a range of transmittance and haze-formation characteristics).

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Examination of a Junction-Box Adhesion Test for Use in Photovoltaic Module Qualification: Preprint

Engineering robust adhesion of the junction-box (j-box) is a hurdle typically encountered by photovoltaic (PV) module manufacturers during product development. There are historical incidences of adverse effects (e.g., fires) caused when the j-box/adhesive/module system has failed in the field. The addition of a weight to the j-box during the 'damp heat' IEC qualification test is proposed toverify the basic robustness of its adhesion system. The details of the proposed test will be described, in addition to the preliminary results obtained using representative materials and components. The described discovery experiments examine moisture-cured silicone, foam tape, and hot-melt adhesives used in conjunction with PET or glass module 'substrates.' To be able to interpret the results,a set of material-level characterizations was performed, including thermogravimetric analysis, differential scanning calorimetry, and dynamic mechanical analysis. PV j-boxes were adhered to a substrate, loaded with a prescribed weight, and then placed inside an environmental chamber (at 85C, 85% relative humidity). Some systems did not remain attached through the discovery experiments. Observedfailure modes include delamination (at the j-box/adhesive or adhesive/substrate interface) and phase change/creep. The results are discussed in the context of the application requirements, in addition to the plan for the formal experiment supporting the proposed modification to the qualification test.

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Examination of a Size-Change Test for Photovoltaic Encapsulation Materials: Preprint

We examine a proposed test standard that can be used to evaluate the maximum representative change in linear dimensions of sheet encapsulation products for photovoltaic modules (resulting from their thermal processing). The proposed protocol is part of a series of material-level tests being developed within Working Group 2 of the Technical Committee 82 of the International ElectrotechnicalCommission. The characterization tests are being developed to aid module design (by identifying the essential characteristics that should be communicated on a datasheet), quality control (via internal material acceptance and process control), and failure analysis. Discovery and interlaboratory experiments were used to select particular parameters for the size-change test. The choice of a sandsubstrate and aluminum carrier is explored relative to other options. The temperature uniformity of +/- 5C for the substrate was confirmed using thermography. Considerations related to the heating device (hot-plate or oven) are explored. The time duration of 5 minutes was identified from the time-series photographic characterization of material specimens (EVA, ionomer, PVB, TPO, and TPU). Thetest procedure was revised to account for observed effects of size and edges. The interlaboratory study identified typical size-change characteristics, and also verified the absolute reproducibility of +/- 5% between laboratories.

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Development of a Visual Inspection Data Collection Tool for Evaluation of Fielded PV Module Condition

A visual inspection data collection tool for the evaluation of fielded photovoltaic (PV) modules has been developed to facilitate describing the condition of PV modules with regard to field performance. The proposed data collection tool consists of 14 sections, each documenting the appearance or properties of a part of the module. This report instructs on how to use the collection tool anddefines each attribute to ensure reliable and valid data collection. This tool has been evaluated through the inspection of over 60 PV modules produced by more than 20 manufacturers and fielded at two different sites for varying periods of time. Aggregated data from such a single data collection tool has the potential to enable longitudinal studies of module condition over time, technologyevolution, and field location for the enhancement of module reliability models.

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Characterization of Field Exposed Thin Film Modules: Preprint

Test arrays of thin film modules have been deployed at the Solar Energy Centre near New Delhi, India since 2002-2003. Performances of these arrays were reported by O.S. Sastry [1]. This paper reports on NREL efforts to support SEC by performing detailed characterization of selected modules from the array. Modules were selected to demonstrate both average and worst case power loss over the 8 yearsof outdoor exposure. The modules characterized included CdTe, CIS and three different types of a-Si. All but one of the a-Si types were glass-glass construction. None of the modules had edge seals. Detailed results of these tests are presented along with our conclusions about the causes of the power loss for each technology.

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How Can We Make PV Modules Safer?: Preprint

Safety is a prime concern for the photovoltaics (PV) industry. As a technology deployed on residential and commercial buildings, it is critical that PV not cause damage to the buildings nor harm the occupants. Many of the PV systems on buildings are of sufficiently high voltage (300 to 600 Volts dc) that they may present potential hazards. These PV systems must be safe in terms of mechanicaldamage (nothing falls on someone), shock hazard (no risk of electrical shock when touching an exposed circuit element), and fire (the modules neither cause nor promote a fire). The present safety standards (IEC 61730 and UL 1703) do a good job of providing for design rules and test requirements for mechanical, shock, and spread of flame dangers. However, neither standard addresses the issue ofelectrical arcing within a module that can cause a fire. To make PV modules, they must be designed, built, and installed with an emphasis on minimizing the potential for open circuits and ground faults. This paper provides recommendations on redundant connection designs, robust mounting methods, and changes to the safety standards to yield safer PV modules.

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Development of a Visual Inspection Checklist for Evaluation of Fielded PV Module Condition (Presentation)

A visual inspection checklist for the evaluation of fielded photovoltaic (PV) modules has been developed to facilitate collection of data describing the field performance of PV modules. The proposed inspection checklist consists of 14 sections, each documenting the appearance or properties of a part of the module. This tool has been evaluated through the inspection of over 60 PV modules producedby more than 20 manufacturers and fielded at two different sites for varying periods of time. Aggregated data from a single data collection tool such as this checklist has the potential to enable longitudinal studies of module condition over time, technology evolution, and field location for the enhancement of module reliability models.

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Proposed Junction-Box Stress Test (Using an Added Weight) for Use During the Module Qualification (Presentation)

Engineering robust adhesion of the junction-box (j-box) is a hurdle typically encountered by photovoltaic (PV) module manufacturers during product development. Furthermore, there are historical incidences of adverse effects (e.g., fires) caused when the j-box/adhesive/module system has failed in the field. The addition of a weight to the j-box during the 'damp heat' IEC qualification test isproposed to verify the basic robustness of the j-box adhesion system. The details of the proposed test are described, in addition to the preliminary results conducted using representative materials and components.

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Testing Protocol for Module Encapsulant Creep (Presentation)

Recently there has been an interest in the use of thermoplastic encapsulant materials in photovoltaic modules to replace chemically crosslinked materials, e.g., ethylene-vinyl acetate. The related motivations include the desire to: reduce lamination time or temperature; use less moisture-permeable materials; or use materials with better corrosion characteristics. However, the use of anythermoplastic material in a high-temperature environment raises safety and performance concerns, as the standardized tests currently do not expose the modules to temperatures in excess of 85C, yet modules may experience temperatures above 100C in operation. Here we constructed eight pairs of crystalline-silicon modules and eight pairs of glass/encapsulation/glass mock modules using differentencapsulation materials of which only two were designed to chemically crosslink. One module set was exposed outdoors with insulation on the back side in Arizona in the summer, and an identical set was exposed in environmental chambers. High precision creep measurements and performance measurements indicate that despite many of these polymeric materials being in the melt state at some of thehighest outdoor temperatures achievable, very little creep was seen because of their high viscosity, temperature heterogeneity across the modules, and in the case of the crystalline-silicon modules, the physical restraint of the backsheet. These findings have very important implications for the development of IEC and UL qualification and safety standards, and in regards to the necessary level ofcure during the processing of crosslinking encapsulants.

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