Engineering topics
Wilkinson, S.
Publications and source records attributed to Wilkinson, S..
Efficiency of SparkJet
The thermal efficiency of a SparkJet is evaluated by measuring the impulse response of a pendulum subject to a single spark discharge. The SparkJet is attached to the end of a pendulum. A laser displacement sensor is used to measure the displacement of the pendulum upon discharge. The pendulum motion is a function of the fraction of the discharge energy that is channeled into the heating of the gas (i.e., increasing the translational-rotational temperature). A theoretical perfect gas model is used to estimate the portion of the energy from the heated gas that results in equivalent pendulum displacement as in the experiment. The earlier results from multiple runs for different capacitances of C = 3, 5, 10, 20, and 40(micro)F demonstrate that the thermal efficiency decreases with higher capacitive discharges.1 In the current paper, results from additional run cases have been included and confirm the previous results
Micro-opto-mechanical devices and systems using epitaxial lift off
The integration of high quality, single crystal thin film gallium arsenide (GaAs) and indium phosphide (InP) based photonic and electronic materials and devices with host microstructures fabricated from materials such as silicon (Si), glass, and polymers will enable the fabrication of the next generation of micro-opto-mechanical systems (MOMS) and optoelectronic integrated circuits. Thin film semiconductor devices deposited onto arbitrary host substrates and structures create hybrid (more than one material) near-monolithic integrated systems which can be interconnected electrically using standard inexpensive microfabrication techniques such as vacuum metallization and photolithography. These integrated systems take advantage of the optical and electronic properties of compound semiconductor devices while still using host substrate materials such as silicon, polysilicon, glass and polymers in the microstructures. This type of materials optimization for specific tasks creates higher performance systems than those systems which must use trade-offs in device performance to integrate all of the function in a single material system. The low weight of these thin film devices also makes them attractive for integration with micromechanical devices which may have difficulty supporting and translating the full weight of a standard device. These thin film devices and integrated systems will be attractive for applications, however, only when the development of low cost, high yield fabrication and integration techniques makes their use economically feasible. In this paper, we discuss methods for alignment, selective deposition, and interconnection of thin film epitaxial GaAs and InP based devices onto host substrates and host microstructures.