Engineering Papers⌕ Search

Engineering topics

Whitley, Karen S.

Publications and source records attributed to Whitley, Karen S..

21 records · Page 2

LDEF polymeric materials: A summary of Langley characterization

The NASA Long Duration Exposure Facility (LDEF) enabled the exposure of a wide variety of materials to the low earth orbit (LEO) environment. This paper provides a summary of research conducted at the Langley Research Center into the response of selected LDEF polymers to this environment. Materials examined include graphite fiber reinforced epoxy, polysulfone, and additional polyimide matrix composites, films of FEP Teflon, Kapton, several experimental high performance polyimides, and films of more traditional polymers such as poly(vinyl toluene) and polystyrene. Exposure duration was either 10 months or 5.8 years. Flight and control specimens were characterized by a number of analytical techniques including ultraviolet-visible and infrared spectroscopy, thermal analysis, scanning electron and scanning tunneling microscopy, x-ray photoelectron spectroscopy, and, in some instances, selected solution property measurements. Characterized effects were found to be primarily surface phenomena. These effects included atomic oxygen-induced erosion of unprotected surfaces and ultraviolet-induced discoloration and changes in selected molecular level parameters. No gross changes in molecular structure or glass transition temperature were noted. The intent of this characterization is to increase our fundamental knowledge of space environmental effects as an aid in developing new and improved polymers for space application. A secondary objective is to develop benchmarks to enhance our methodology for the ground-based simulation of environmental effects so that polymer performance in space can be more reliably predicted.

Young, Philip R.↗

Aromatic Polyimides Containing Meta-Biphenoxy Moieties

Synthesis of two novel monomers and subsequent incorporation into aromatic polyimides yields polyimides containing meta-biphenoxy moieties exhibiting stability at high temperatures and having glass-transition temperatures lower than state-of-the-art polyimides containing para-biphenoxy moieties. Because of outstanding thermal stability, low density, resistance to radiation, electrical-insulating capability, toughness, and flexibility, linear aromatic polyimides used increasingly for applications in aerospace and electronics industries and possibly in others.

St. Clair, Terry L.↗

High-Temperature Copolyimide Adhesive

Random Copolyimide, called STPI/LARC, prepared from commercially available materials. Being investigated for use as adhesive or matrix resin for aircraft applications.

Progar, Donald J.↗