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Stobb, C. A.

Publications and source records attributed to Stobb, C. A..

Overall contact conductance of a prototype Parallel Fin Thermal Interface

The Parallel Fin Thermal Interface has been developed and tested as an orbital replaceable interface. The interface consists of two identical plates with pairs of opposing parallel straight fins. Each pair of fins is sandwiched between two insert plates pressed against the fins with enough force for good heat transfer through the interface. Two prototype parallel fin interfaces were built (Model 140 and 380) with different fin and insert plate dimensions. Samples of the interfacing surfaces were found to have roughness values ranging from 22 to 35 microinches. Overall interface conductance (Hc) values of 46.7 to 74.2 Btu/hr sq ft-F were obtained for the 140 model in vacuum with an interface pressure from 18.8 to 37.5 psi, respectively. The Model 380 exhibited Hc values from 31.2 to 46.8 Btu/hr sq ft-F in vacuum, with respective interface pressures of 14.2 and 22.0 psi. Several correlations were found to agree with test data to within 20 percent.

Stobb, C. A.

Parallel Fin ORU Thermal Interface for space applications

The Parallel Fin Thermal Interface has been developed as an Orbital Replaceable Unit (ORU) interface. The interface transfers heat from an ORU baseplate to a Heat Acquisition Plate (HAP) through pairs of fins sandwiched between insert plates that press against the fins with uniform pressure. The insert plates are spread apart for ORU baseplate separation and replacement. Two prototype interfaces with different fin dimensions were built (Model 140 and 380). Interfacing surface samples were found to have roughnesses of 56 to 89 nm. Conductance values of 267 to 420 W/sq m C were obtained for the 140 model in vacuum with interface pressures of 131 to 262 kPa (19 to 38 psi). Vacuum conductances ranging from 176 to 267 W/sq m F were obtained for the 380 model at interface pressures of 97 to 152 kPa (14 and 22 psi). Correlations from several sources were found to agree with test data within 20 percent using thermal math models of the interfaces.

Stobb, C. A.