Engineering topics

St. Clair, Anne K.

Publications and source records attributed to St. Clair, Anne K..

30 records · Page 2

NASA NTRS1990

Additives Lower Dielectric Constants Of Polyimides

Dielectric constants as low as 2.43 make polyimides more attractive for electronic applications. Process makes aromatic condensation polyimide films and coatings with dielectric constants lowered by incorporation of diamic acid additives. Materials provide better electrical insulation without sacrificing temperature stability of polyimide binders. Applicable whenever high temperature, low absorption of moisture, and high electrical-insulation properties needed. Applications include semiconductors and printed-circuit boards for computer industry and possibly automotive industry.

Stoakely, Diane M.↗

NASA NTRS1990

Polyimides from a methylene-bridged dianhydride

High-molecular weight, high-temperature, highly optically transparent films suitable for electronic and aerospace applications were prepared based on a novel methylene-bridged dianhydride 3,3-prime bis(3,4-dicarboxyphenoxy) diphenylmethane dianhydride (PDMDA). All films had lower dielectric constants and significantly higher optical transparency than the commercial Kapton H film, with air-cured films having slightly higher dielectric constants and lower optical transparency than vacuum films, due to oxidative cross-linking.

Boston, Harold G.↗

NASA NTRS1990

Thermally stable, low dielectric polyquinolines for aerospace and electronics applications

Four new high molecular weight, linear chain polyquinolines have been synthesized and fabricated into high quality free standing films. These polymers are characterized by moderate to high glass transition temperatures, excellent thermal and thermooxidative stability, extremely low dielectric constants and good planarizing characteristics. The polymers absorb very low quantities of moisture. As a consequence, the dielectric constant of one new polyquinoline has been shown to be quite insensitive to exposure to warm/wet conditions. Isothermal aging of one new derivative in air has been carried out at elevated temperatures (250 C to 345 C). The results demonstrate truly outstanding thermooxidative stability. Additional characterizations include molecular weight determinations, solubilities and film-forming characteristics, density measurements, and UV-Vis spectroscopy. The data acquired to date suggest that the polymers may find use as refractive films and coatings and as interlevel planarizers in microelectronics applications.

Hendricks, Neil H.↗

NASA NTRS1989

Tensil Film Clamps And Mounting Block For Viscoelastometers

Set of clamps and mounting block developed for use in determining tensile moduli and damping properties of films in manually operated or automated commercial viscoelastometer. These clamps and block provide uniformity of sample gripping and alignment in instrument. Dependence on operator and variability of data greatly reduced.

Stoakley, Diane M.↗

NASA NTRS1989

Soluble Aromatic Polyimides For Film Coating

Because of toughness, flexibility, and remarkable thermal stability, linear all-aromatic polyimides excellent candidate film and coating materials for advanced electronic circuitry and wires. Study determined effects on solubility of changing isomeric points of attachment of phenoxy units in diamine portions of several all-aromatic polyimides. Tough, flexible, transparent films produced by thermally converting polyamic acids to polyimides at 300 degree C in air. Potential for electronic applications excellent.

St. Clair, Anne K.↗

NASA NTRS1989

Low-Dielectric Polyimides

New process developed to produce aromatic condensation polyimide films and coatings having dielectric constants in range of 2.4 to 3.2. Materials better electrical insulators than state-of-the-art commercial polyimides. Several low-dielectric-constant polyimides have excellent resistance to moisture. Useful as film and coating materials for both industrial and aerospace applications where high electrical insulation, resistance to moisture, mechanical strength, and thermal stability required. Applicable to production of high-temperature and moisture-resistance adhesives, films, photoresists, and coatings. Electronic applications include printed-circuit boards, both of composite and flexible-film types and potential use in automotive, aerospace, and electronic industries.

St. Clair, Anne K.↗

NASA NTRS1988

The effect of diamic acid additives on the dielectric constant of polyimides

The effect of six selected diamic acids additives (including 2,2-prime bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride-aniline (An); 4,4-prime-oxydiphthalic anhydride-An, 3,3-prime diaminodiphenyl sulfone-phthalic anhydride (PA); 4,4-prime-oxydianiline-PA; 2,2-bis 4(4-aminophenoxy)phenyl hexafluoropropane-PA; and 2,2-bis 4(3-aminophenoxy)phenyl hexafluoropropane-PA) on the dielectric constants of low-dielectric-constant polyimide resins was evaluated. It was found that the effect of the incorporation of the diamic acids on reducing the dielectric constant of polyimides may be limited as the dielectric constant of the base resin itself becomes very low. The additives were found to lower the resin's values of glass transition temperature, with no effect on thermooxidative stability.

Stoakley, Diane M.↗

NASA NTRS1988

Soluble and colorless polyimides

Results are reported in the form of reaction diagrams, graphs, and tables of research being conducted to synthesize and characterize linear aromatic polyimides which are soluble in common organic solvents and optically transparent in the 400-600 nm spectral range. These flexible and high-temperature polymeric films and coatings are needed for specific applications on space components such as antennas, solar cells, and thermal control coating systems. Several series of these polyimide films have been produced by making variations in the polymer molecular structure aimed at reducing the electronic interactions between the polymer chains.

St. Clair, Anne K.↗

NASA NTRS1987

Processable Polyimides Containing ATBN Elastomers

Void-free moldings obtained without serious sacrifice in other properties. New synthesis produces high-temperture linear aromatic polyimide processed in imide form to yield tough, void-free components without serious sacrifice in other properties. Linear aromatic condensation polyimides are materials of prime choice for use as adhesives, composite matrix resins, films, coatings, and/or moldings where durability at temperatures as high as 200 to 300oC needed. Finding increasing use in aircraft and spacecraft applications.

St. Clair, Anne K.↗

NASA NTRS1987

Colorless Polyimide Films for Thermal-Control Coatings

Series of six essentially colorless aromatic polyimide films synthesized and characterized with objective of obtaining maximum optical transparency for applications in space; optical transparency requirement for high-performance polymeric films used in second-surface mirror coatings on thermal-control systems. Films remain more transparent than commercial film after ultraviolet and electron irradiation. Increased transparency and enhanced solubility of optically transparent polyimides makes them viable candidates for use in thermal-control coatings.

St. Clair, Anne K.↗

NASA NTRS1987

Soluble aromatic polyimides for film and coating applications

The effect of changing isomeric points of attachment of phenoxy units in the diamine portion of several all-aromatic polyimide systems on the solubility of these materials were investigated. It was found that solubility could be enhanced by the presence of meta and ortho isomer links in the diamine portion of the molecule. The soluble phenoxy-linked polyimides yield tough flexible colorless to pale-yellow transparent films from solutions of chlorinated solvents, with high potential for use in electronic applications.

St. Clair, Anne K.↗

NASA NTRS1987

Lanthanide-containing polyimides

The preparation of a variety of lanthanide-containing polyimide films is described, and results of their characterization are presented. The properties investigated include the glass transition temperature, thermooxidative stability, magnetic susceptibility, and electrical conductivity of the polymer. Films containing lanthanide chlorides, fluorides, and sulfides are flexible, but those containing lanthanide nitrates are extremely brittle. The addition of lanthanide acetates and acetylacetonates caused immediate gelation of two of the synthesis-mixture ingredients. It was found that, in general, the addition of lanthanide to the polyimide increases the density and glass transition temperature of the polymer but slightly decreases the thermooxidative stability.

Stoakley, D. M.↗