Multiply-charged argon ion irradiation of microfabricated niobium wires
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Engineering topics
Publications and source records attributed to Srijanto, Bernadeta.
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The development of superjunction structures for use in vertical wide bandgap power devices promise to break the 1-D material limits. Additionally, the possibility of utilizing heteroepitaxial GaN-on-Sapphire wafer for vertical devices can significantly trim the material and device cost. This work introduces a quasi-vertical GaN-on-Sapphire superjunction PN diode design utilizing sputtered p-NiO on the etched GaN fins for superjunction formation. DC breakdown voltage is shown to vary with superjunction charge imbalance and significantly exceed the expected 1-D planar limit of 350V given the epilayer design used. A maximum breakdown voltage of 840 V is extracted for near charge balance conditions limited by leakage current. Dynamic breakdown of the device is characterized as a function of reverse voltage slew rate. A maximum dynamic breakdown voltage of 1160 V under a reverse voltage slew rate of 2000 V/μs is found.
We demonstrate an optical analog-to-digital converter (ADC) leveraging spectral interferometry of an integrated electro-optic Mach-Zehnder interferometer on thin-film lithium niobate. The ADC features a high dynamic range of 118 dB/Hz with a 3-Vpp input range.