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Spivak, A. L.

Publications and source records attributed to Spivak, A. L..

Thermal Conductances Of Cold Metal Contacts Below 6 K

Conductances vary with temperature according to simple power law. Report presents data on thermal conductances of pure aluminum and stainless-steel 304 contact pairs. Data cover contacts with surface finishes of 0.1- to 1.6-micrometer root-mean-square roughness at temperatures from 1.6 to 6.0 K, under applied contact forces up to 670 N. Such data needed for optimal design of bolted joints in cryogenic instruments, particularly infrared instruments and focal-plane sensors.

Salerno, L. J.↗

Thermal conductance of augmented pressed metallic contacts at liquid helium temperatures

The thermal conductance of uncoated oxygen-free high conductivity (OFHC) copper, 6061-T6 aluminum, free-machining brass, and 304 stainless steel sample pairs which were augmented with a gold coated 6061-T6 aluminum washer inserted between the contact surfaces was measured over the temperature range of 1.6 to 6.0 K, with applied forces from 22 to 670 N. The contact surfaces of the sample pairs were prepared with a 0.8 micron lapped finish, while the finish of the aluminum washer was 0.2 micron lapped. The contribution to the overall thermal impedance by the bulk conductance of the aluminum washer was negligible. It was found that addition of the washer offered no significant conductance improvement over an uncoated single contact pair; any benefits from using the gold plated washer were counteracted by the addition of two more contact surfaces. Additionally, the thermal conductance of a 'combination' aluminum sample pair having one gold coated and one uncoated surface was measured and compared to the washer pair. The ratio of the conductance of the washer pair to half the conductance of the 'combination' pair was found to be constant and near unity over the temperature range of the data obtained, within experimental error.

Salerno, L. J.↗

Performance of all-metal demountable cryogenic seals at superfluid helium temperatures

Two all-metal demountable cryogenic seals with an outside diameter of 36.6 mm, inside diameter of 27.2 mm and thickness of 0.51 mm were leak-tested at room temperature (300 K), liquid nitrogen temperature (21 cycles at 77 K), liquid helium temperature (nine cycles at 4.2K) and superfluid helium temperature (four cycles at 1.6 K). Each seal was mounted and demounted for 13 cycles. Thickness measurements at 90 deg intervals along the circumference showed a maximum seal compression of 0.038 mm. Leak rate measurements at all temperatures showed no detectable leak above the helium background level, typically 0.1 x 10 exp -9 std cu cm/s, during testing.

Salerno, L. J.↗

SHOOT flowmeter and pressure transducers

A venturi flowmeter has been designed and constructed for the Superfluid Helium On-Orbit Transfer (SHOOT) experiment. The calibration results obtained from the SHOOT venturi demonstrate the ability of the flowmeter to meet the requirements of the SHOOT experiment. Flow rates as low as 20 cu dm/h and as high as 800 cu dm/h have been measured. Performances of the SHOOT differential and absolute pressure transducers, which have undergone calibration and vibration tests, are also included. Throughout the tests, the responses of the transducers remained linear and repeatable to within + or - 1 percent of the full scales of the transducers.

Kashani, A.↗

Thermal Conductances Of Metal Contacts

Report presents results of measurements of thermal conductances of aluminum and stainless-steel contacts at temperatures from 1.6 to 6.0 K. Measurement apparatus includes gearmotor assembly connected to rocker arm by music wire to load sample pair with forces up to 670 N. Heater placed above upper sample. Germanium resistance thermometers in upper and lower samples measured temperature difference across interface over range of heater powers from 0.1 to 10.0 mW. The thermal conductance calculated from temperature difference. Measurements provide data for prediction of thermal conductances of bolted joints in cryogenic infrared instruments.

Salerno, L. J.↗

Thermal conductance of pressed aluminum and stainless steel contacts at liquid helium temperatures

The thermal conductance of aluminum and stainless steel 304 sample pairs with surface finishes ranging from 0.1 to 1.6 microns rms roughness was investigated over a temperature range from 1.6 to 6.0 K. The thermal conductance follows a simple power law function of temperature, with the exponent ranging from 0.5 to 2.25, increases asymptotically with increasing applied force, and exhibits an anomaly for surface finishes in the 0.4 micron region.

Salerno, L. J.↗

Thermal conductance of pressed brass contacts at liquid helium temperatures

An apparatus has been designed and fabricated which will measure the thermal conductance of pressed contacts at liquid helium temperatures as a function of applied force, with surface finish as a parameter. The apparatus is automated and was used to measure thermal conductance at temperatures from 1.5 to 6.5 K at applied forces up to 700 N for brass sample pairs having surface finishes from 0.1 to 1.6 micron rms. The experimental data were found to fit a simple power law where the thermal conductance is given by k = alpha T exp n, where k is the thermal conductance, T is the absolute temperature, and alpha and n are empirically determined constants.

Salerno, L. J.↗

Thermal conductance of pressed aluminum and stainless steel contacts at liquid helium temperatures

The thermal conductance of aluminum and stainless steel 304 sample pairs with surface finishes ranging from 0.1 to 1.6 microns rms roughness was investigated over a temperature range from 1.6 to 6.0 k. The thermal conductance follows a simple power law function of temperature, with the exponent ranging from 0.5 to 2.25, increases asymptotically with increasing applied force, and exhibits an anomaly for surface finishes in the 0.4 micron region.

Salerno, L. J.↗

Thermal conductance measurements of pressed OFHC copper contacts at liquid helium temperatures

The thermal conductance of oxygen-free high conductivity (COFHC) copper sample pairs with surface finishes ranging from 0.1 to 1.6-micrometers rms roughness was investigated over the range of 1.6 to 6.0-K under applied contact forces up to 670 N. The thermal conductance increases with increasing contact force; however, no correlation can be drawn with respect to surface finish.

Salerno, L. J.↗

A helium-3 refrigerator employing capillary confinement of liquid cryogen

A condensation refrigerator suitable for operation in a zero gravity space environment was constructed. The condensed liquid refrigerant is confined by surface tension inside a porous metal matrix. Helium-4 and helium-3 gases were condensed and held in a copper matrix. Evaporative cooling of confined liquid helium-4 resulted in a temperature of 1.4K. Using a zeolite adsorption pump external to the cryostat, a temperature of 0.6 K was achieved through evaporative cooling of liquid helium-3. The amount of time required for complete evaporation of a controlled mass of liquid helium-4 contained in the copper matrix was measured as a function of the applied background power. For heating powers below 18 mW the measured times are consistent with the normal boiling of the confined volume of liquid refrigerant. At background powers above 18 mW the rapid rise in the temperature of the copper matrix the signature of the absence of confined liquid occurs in a time a factor of two shorter than that expected on the basis of an extrapolation of the low power data.

Ennis, D. J.↗

Thermal conductance measurements of pressed OFHC copper contacts at liquid helium temperatures

The thermal conductance of oxygen-free high conductivity (OFHC) copper sample pairs with surface finishes ranging from 0.1 to 1.6-micrometers rms roughness was investigated over the range of 1.6 to 6.0-K under applied contact forces up to 670 N. The thermal conductance increases with increasing contact force; however, no correlation can be drawn with respect to surface finish.

Salerno, L. J.↗

Thermal conductance of pressed contacts at liquid helium temperatures

It is pointed out that the optimum design of cryogenic instruments requires accurate thermal models. The present models are limited by a lack of knowledge of the low temperature thermal conductance of the bolted joints which are typically used in the instrument-to-system interface. In connection with studies of pressed contacts, it has been found that the thermal conductance does not obey the Wiedemann-Franz law. The present investigation is concerned with the characterization of the thermal conductance of pressed contacts at liquid helium-4 temperatures, taking into account the dependence of thermal contact conductance on applied force and temperature. It is shown that for the 0.4 micron OFHC copper pressed contact pair, the thermal conductance varies roughly as the second power of the temperature, and increases with increasing applied force.

Salerno, L. J.↗

Thermal conductance of pressed contacts at liquid helium temperatures

The thermal contact conductance of a 0.4 micrometer surface finish OFHC copper sample pair has been investigated from 1.6 to 3.8 K for a range of applied contact forces up to 670 N. Experimental data have been fitted to the relation Q = the integral alpha T to the nth power dt by assuming that the thermal contact conductance is a simple power function of the sample temperature. It has been found that the conductance is proportional to T squared and that conductance increases with an increase in applied contact force. These results confirm earlier work.

Salerno, L. J.↗

A cryogenic valve for spacecraft applications

Space-compatible cryogenic valves are now required to operate between room and liquid helium temperatures. A remotely controllable cryogenic valve is described, which is made of bellows-type stainless steel and is operated by a miniature dc motor with integral gearset (485:1) at a nominal voltage of 28 Vdc. The power transmission provides a further reduction of 7.2:1 to give an overall gear ratio of nearly 3500:1, assuring reliability of operation at low temperatures. Valve performance (leak rate) data are presented at LN2, LHe, and SfHe temperatures at delivered torques of 18, 27, 31, and 35 N-m. At a closing torque of 31 N-m, a leak rate of 0.028 scc/sec was achieved at 2 K, while at a torque of 18 N-m the leak rate at 300 K was less than 3 x 10 to the -9th scc/sec.

Salerno, L. J.↗