Engineering topics
Publications and source records attributed to Smith, Janice Y..
The motivation for this work is to develop self-healing polymeric materials to enable damage tolerant systems, and to tailor puncture healing for use temperatures and applications. This will be a benefit in environments and conditions where access for manual repair is limited or impossible, or where damage may not be detected.
Advance in polymer technology yields composites having relatively low dielectric constants. Reduction achieved by reducing interactions between linear polyimide chains and by incorporation of fluorine into polymer backbones. Further reductions obtained by physically incorporating selected diamic acid additives into polyimides. Strong potential for use in microelectronics industry for fabrication of printed-circuit boards and fabrication of components for military aircraft.
High-performance polymer made by new synthesis in which one or more easy-to-process, but brittle, thermosetting polyimides combined with one or more tough, but difficult-to-process, linear thermoplastics to yield semi-interpenetrating polymer network (semi-IPN) having combination of easy processability and high tolerance to damage. Two commercially available resins combined to form tough, semi-IPN called "LaRC-RP49." Displays improvements in toughness and resistance to microcracking. LaRC-RP49 has potential as high-temperature matrix resin, adhesive, and molding resin. Useful in aerospace, automotive, and electronic industries.
Low-toxicity and low-mutogenicity monomer key to new high-performance polyimide. LaRC-IA is thermoplastic polyimide made from 3-4'-oxydianiline and 4,4'-oxydiphthalic anhydride. Good processing characteristics, low toxicity, and no mutagenicity. Adhesives, composite matrix resins, heat resin moldings, and coating films made of new polymer found to exhibit properties identical or superior to commercially available polyimides. Potential applications wide ranging. With and without end capping, employed to prepare unfilled moldings, coatings and free films, adhesive tape, adhesively bonded substrates, prepregs, and composites.