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Siles, Jose

Publications and source records attributed to Siles, Jose.

23 records · Page 2
All sourcesNASA NTRSDOE OSTI
NASA NTRS2016

THz Limb Sounder (TLS) for Lower Thermospheric Wind, Oxygen Density, and Temperature

Neutral winds are one of the most critical measurements in the lower thermosphere and E region ionosphere (LTEI) for understanding complex electrodynamic processes and ion-neutral interactions. We are developing a high-sensitivity, low-power, noncryogenic 2.06 THz Schottky receiver to measure wind profiles at 100-140 km. The new technique, THz limb sounder (TLS), aims to measure LTEI winds by resolving the wind-induced Doppler shift of 2.06 THz atomic oxygen (OI) emissions. As a transition between fine structure levels in the ground electronic state, the OI emission is in local thermodynamic equilibrium(LTE) at altitudes up to 350km. This LTE property, together with day-and-night capability and small line-of-sight gradient, makes the OI limb sounding a very attractive technique for neutral wind observations. In addition to the wind measurement, TLS can also retrieve [OI] density and neutral temperature in the LTEI region. TLS leverages rapid advances in THz receiver technologies including subharmonically pumped (SHP)mixers and Schottky-diode-based power multipliers. Current SHP Schottky receivers have produced good sensitivity for THz frequencies at ambient environment temperatures (120-150 K), which are achievable through passively cooling in spaceflight. As an emerging technique, TLS can fill the critical data gaps in the LTEI neutral wind observations to enable detailed studies on the coupling and dynamo processes between charged and neutral molecules.

wind profiles↗
NASA NTRS2013

Silicon Alignment Pins: An Easy Way to Realize a Wafer-to-Wafer Alignment

Submillimeter heterodyne instruments play a critical role in addressing fundamental questions regarding the evolution of galaxies as well as being a crucial tool in planetary science. To make these instruments compatible with small platforms, especially for the study of the outer planets, or to enable the development of multi-pixel arrays, it is essential to reduce the mass, power, and volume of the existing single-pixel heterodyne receivers. Silicon micromachining technology is naturally suited for making these submillimeter and terahertz components, where precision and accuracy are essential. Waveguide and channel cavities are etched in a silicon bulk material using deep reactive ion etching (DRIE) techniques. Power amplifiers, multiplier and mixer chips are then integrated and the silicon pieces are stacked together to form a supercompact receiver front end. By using silicon micromachined packages for these components, instrument mass can be reduced and higher levels of integration can be achieved. A method is needed to assemble accurately these silicon pieces together, and a technique was developed here using etched pockets and silicon pins to align two wafers together.

Jung-Kubiak, Cecile↗
NASA NTRS2012

Array Technology for Terahertz Imaging

Heterodyne terahertz (0.3 - 3THz) imaging systems are currently limited to single or a low number of pixels. Drastic improvements in imaging sensitivity and speed can be achieved by replacing single pixel systems with an array of detectors. This paper presents an array topology that is being developed at the Jet Propulsion Laboratory based on the micromachining of silicon. This technique fabricates the array's package and waveguide components by plasma etching of silicon, resulting in devices with precision surpassing that of current metal machining techniques. Using silicon increases the versatility of the packaging, enabling a variety of orientations of circuitry within the device which increases circuit density and design options. The design of a two-pixel transceiver utilizing a stacked architecture is presented that achieves a pixel spacing of 10mm. By only allowing coupling from the top and bottom of the package the design can readily be arrayed in two dimensions with a spacing of 10mm x 18mm.

Terahertz↗
NASA NTRS2011

Terahertz Array Receivers with Integrated Antennas

Highly sensitive terahertz heterodyne receivers have been mostly single-pixel. However, now there is a real need of multi-pixel array receivers at these frequencies driven by the science and instrument requirements. In this paper we explore various receiver font-end and antenna architectures for use in multi-pixel integrated arrays at terahertz frequencies. Development of wafer-level integrated terahertz receiver front-end by using advanced semiconductor fabrication technologies has progressed very well over the past few years. Novel stacking of micro-machined silicon wafers which allows for the 3-dimensional integration of various terahertz receiver components in extremely small packages has made it possible to design multi-pixel heterodyne arrays. One of the critical technologies to achieve fully integrated system is the antenna arrays compatible with the receiver array architecture. In this paper we explore different receiver and antenna architectures for multi-pixel heterodyne and direct detector arrays for various applications such as multi-pixel high resolution spectrometer and imaging radar at terahertz frequencies.

direct detector arrays↗