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Sheldon, Douglas

Publications and source records attributed to Sheldon, Douglas.

At least 19 records

Radiation Effects Characterization and System Architecture Options for the 7nm Snapdragon SA8155P Automotive Grade System on Chip (SoC)

The SA8155P SoC is a complex heterogeneous computational platform with CPUs, GPU, DSPs and NPU. The SA8155P is a 7 TOPS/7 Watts capable AI/ML platform and as such represents a game changing breakthrough in terms computational power for space applications. We characterize the TID and SEE effects of the Qualcomm SA8155P Automotive grade SoC. Individual sub-system testing as well as application specific full device testing was conducted. We also discuss the commercial and automotive recovery mechanisms that are available with the SA8155P SoC generation and how those can form the basis for resilient architecture options for use in future space missions

Allen, Greg

Benchmarking and Testing of Qualcomm Snapdragon System-on-Chip for JPL Space Applications and Missions

As some space missions become more challenging due to new environments, greater distances, or more limited size, weight, and power (SWaP) constraints, spacecraft avionics must adapt to allow the spacecraft to be more autonomous and agile---eliminating the Spacecraft-Earth-Spacecraft feedback loop whenever possible. Prime examples of such missions include Aerobots (such as Ingenuity with extremely low SWaP constraints and demanding signal/image processing during flight) and landers in possibly hostile environments (such as a Europa lander mission, with limited communication capacity, high latency, and constrained power budget). To address these challenges, JPL worked with Qualcomm to demonstrate the use of their Snapdragon 801 system-on-chip (SoC) onboard the Ingenuity Helicopter on Mars. The Qualcomm Snapdragon SoC contains various subsystems, including an ARM cluster, a Graphics processing unit, a Digital Signal Processing subsystem, a Neural Processing Engine, Image Signal Processing subsystem, among others. Since the success of Ingenuity, JPL is continuing to work with Qualcomm to address other applications of the Snapdragon SoC technology. This includes the deployment of two 855 Snapdragon development boards onboard the International Space Station (ISS) for successful in-situ benchmarking of applications in space (beyond those tested on Ingenuity). In this paper, we will examine the performance of various applications that have been identified to benefit from greater onboard computational capability. These applications include (among others): machine vision algorithms that are expected to be critical in autonomous entry-descent-and-landing scenarios and real-time Aerobot flight navigation; Hyperspectral compression algorithms; Synthetic Aperture Radar Processing along with various instrument processing algorithms. We discuss how the infusion of Qualcomm's Snapdragon SoC is capable of enabling missions that may not have been able to achieve their goals with traditional flight computing. In addition, we also show that for some algorithms, the software implementation on the Snapdragon SoC outperforms traditional FPGA implementations.

Cretu, Vlad

Environmental Design Implications for Deep Space SmallSats

The paper will describe the key technical drivers on the Sylph mission concept to explore a plume at Europa as a secondary free-flyer as a part of the planned Europa Mission. Sylph is a radiation-hardened smallsat concept that would utilize terrain relative navigation to fly at low altitudes through a plume, if found, and relay the mass spectra data back through the flyby spacecraft during its 24-hour mission. The second topic to be discussed will be the mission design constraints of the Near Earth Asterioid (NEA) Scout concept. NEAScout is a 6U cubesat that would utilize an 86 sq. m solar sail as propulsion to execute a flyby with a near-Earth asteroid and help retire Strategic Knowledge Gaps for future human exploration. NEAScout would cruise for 24 months to reach and characterize one Near-Earth asteroid that is representative of Human Exploration targets and telemeter that data directly back to Earth at the end of its roughly 2.5 year mission.

Kahn, Peter

Reliability Characterization of TaOx-Based Commercial ReRAM in Combination with Radiation

We present reliability data combined with total dose gamma radiation for one of the first commercially available resistive memory devices. These Tantalum Oxide (TaOX)-based resistive memory chips demonstrate operation in dynamic program and erase testing up to ~130 Krad(Si) of 60Co gamma dose. In static and unbiased conditions, the stored data in the memory cells were able to withstand up to 50Mrad(Si) of exposure. The access circuitry, though, seemed less robust to gamma radiation and was able to operate only up to a total dose of 3Mrad(Si). Post exposure reliability as indicated by endurance, cycling error rate, and data retention tests showed no detectable impact from the combination with prior gamma irradiation. Overall, the total dose radiation tolerance of the commercial TaOx-based resistive memory chip appears to be higher than flash memory chips and in agreement with prior tests conducted with single cell resistive memories.

total ionizing dose

NEPP non-volatile memory : FY09 summary report

This report documents the activities and results of the fiscal year 2009 (FY09) funding for the NASA Electronic Parts and Packaging (NEPP) program for non-volatile memory (NVM) devices. The FY09 task was divided into two main efforts: 1. Development of in-house measurement capability for flash devices 2. Reliability characterization of multi-level vs. single-level flash devices The FY09 NEPP Non Volatile Memory study was organized into these two sections in recognition of the continued and increasing importance of NVM to NASA. All NASA missions use NVM for boot code storage and some limited data archiving. Space-grade NVM has lagged commercial NVM development by many orders of magnitude, however. This gap in density only continues to increase as space-grade memories remain constant in the 1–16 Mbit levels, while commercial flash-based devices shrink in size and double in capacity every 18 months. Commercial flash devices are now at the 32 Gbit level, 10,000 times denser than current NASA NVM. This FY marks the beginning of a significant technological transition in NVM for NASA. The aggressive scaling of commercial NVMs has, as a by-product, made some of the flash devices radiation-tolerant enough to be at least considered for low-level radiation environment missions [Irom 2008]. This NEPP task is focused on understanding the reliability and potential future applications of such highly scaled flash memories.

Heidecker, Jason

FPGA NEPP : FY09 summary report

This report documents the activities and results of the fiscal year 2009 (FY09) funding for the NASA Electronic Parts and Packaging (NEPP) program for re-programmable field programmable gate arrays (FPGAs). The FY09 task was divided into three efforts: 1. Device physics-based design modifications 2. Contention study of Xilinx Virtex-4 3. IDDQ study of Actel A54SX The FY09 NEPP FPGA study was organized into these three sections in recognition of the continued and increasing importance of FPGAs to NASA. FPGAs represent the state of the art in electronic components with millions and millions of transistors integrated into a single device. Modern NASA spacecraft design has dozens and dozens of FPGAs implemented onboard. FPGAs are used in critical command and data handling, instrument control and monitoring, and communications protocols, to name just a few. The reliability of FPGAs is fundamental to mission success for NASA.

Sheldon, Douglas

On Nibbles and Bytes: The Conundrum of Memory for Space Systems - NASA Electronic Parts and Packaging (NEPP) and Efforts in Memories

Radiation requirements and trends. TID: 1) >90% of NASA applications are < 100 krads-Si in piecepart requirements. a) Many commercial devices (NVM and SDRAMs) meet or come close to this. b) Charge pump TID tolerance has improved an order magnitude over the last 10 years. 2) There are always a few programs with higher level needs and, of course, defense needs SEL: 1) Prefer none or rates that are considered low risk. a) Latent damage is a bear to deal with. 2) As we re packing cells tighter and even with lower Vdd, we re seeing SEL on commercial devices regularly (<90nm). a) Often in power conversion, I/O, or control areas. SEU: 1) It s not the bit errors, it s the SEFIs errors that are the biggest issues. a) Scrubbing concerns for risk, power, speed.

LaBel, Kenneth A.

Disturb testing in flash memories

Non-volatile memory technology as defined by NAND architecture flash memory continues to lead the process scaling and device shrinking efforts of the entire integrated circuit industry. 45- nm technology nodes are now producing commercial 32Gb devices. These latest 32Gb devices are pioneering new charge trapping memory cell technologies using metal gates and high-k dielectric materials. These cells are called TANOS and consist of tantalum-nitride, aluminum oxide (high k material), nitride, oxide, and silicon. Such high-density memories continue to revolutionize commercial electronics in terms of new high-speed data architectures and significant reductions in overall power and weight consumption. In stark contrast, nearly all science-based interplanetary and earth-orbiting NASA spacecraft are still designing in and around mid-1980s-level non-volatile technology with 1Mb Electrically Erasable Read-Only Memory (EEPROM) devices. NASA has typically shunned the use of modern flash devices because of radiation and reliability concerns due to the commercial-offthe– shelf (COTS) nature of the NAND flash technology. Given the significant potential increases in overall system capability these modern flash devices could bring to NASA missions, it is important to continue to investigate these devices. This report will investigate certain portions of the reliability performance of NAND flash devices, specifically the disturb properties. Understanding the possible limitations such new non-volatile memory technology presents to NASA is the goal of this report.

Freie, Michael