Engineering topics

Shaw, Harry

Publications and source records attributed to Shaw, Harry.

24 records · Page 2

NASA NTRS2005

Advanced DC/DC Converters Towards Higher Volumetric Efficiencies For Space Applications

A new emphasis on planetary exploration by NASA drives the need for small, high power DC/DC converters which are functionally modular. NASA GSFC and other government space organizations are supporting technology development in the DC/DC converter area to both meet new needs and to promote more sources of supply. New technologies which enable miniaturization such as embedded passive technologies and thermal management using high thermal conductivity materials are features of the new designs. Construction of some simple DC/DC converter core circuits using embedded components was found to be successful for increasing volumetric efficiency to 37 W/inch. The embedded passives were also able to perform satisfactorily in this application in cryogenic temperatures.

Shaw, Harry↗

NASA NTRS2001

A Controlled Arc Welding and Separation Processes for Carbon Nanotubes

Stage 1 for the Carbon Nanotube Project has been completed. This videograph presents the proposal for Stage 2. The goals of this stage are to: (1) produce CNTs under different conditions such as cooling temperature, voltage, current, cathode and anode sizes; (2) use ferrocene to make longer CNTs; (3) characterize CNTs by spectroscopic methods; (4) develop applications of CNTs, i.e., batteries, composites, wires, etc.; and (5) complete the patent application.

Benavides, Jeannette↗

NASA NTRS2001

Multi-Frequency Soliton Complex in Er/Yb-Doped Fiber Amplifier

We experimentally investigated presence of multi-frequency soliton complex that exist in high power Er/Yb-doped Fiber Amplifier. The complex with the spectral bandwidth in excess of 100 nm is bound by the Kerr nonlinearity and exhibit stable propagation.

Kang, Jin U.↗

NASA NTRS2000

Thermal Characterization for a Modular 3-D Multichip Module

NASA Goddard Space Flight Center has designed a high-density modular 3-D multichip module (MCM) for future spaceflight use. This MCM features a complete modular structure, i.e., each stack can be removed from the package without damaging the structure. The interconnection to the PCB is through the Column Grid Array (CGA) technology. Because of its high-density nature, large power dissipation from multiple layers of circuitry is anticipated and CVD diamond films are used in the assembly for heat conduction enhancement. Since each stacked layer dissipates certain amount of heat, designing effective heat conduction paths through each stack and balancing the heat dissipation within each stack for optimal thermal performance become a challenging task. To effectively remove the dissipated heat from the package, extensive thermal analysis has been performed with finite element methods. Through these analyses, we are able to improve the thermal design and increase the total wattage of the package for maximum electrical performance. This paper provides details on the design-oriented thermal analysis and performance enhancement. It also addresses issues relating to contact thermal resistance between the diamond film and the metallic heat conduction paths.

Fan, Mark S.↗

NASA NTRS2000

NASA GSFC Tin Whisker Homepage http://nepp.nasa.gov/whisker

The NASA GSFC Tin Whisker Homepage provides general information and GSFC Code 562 experimentation results regarding the well known phenomenon of tin whisker formation from pure tin plated substrates. The objective of this www site is to provide a central repository for information pertaining to this phenomenon and to provide status of the GSFC experiments to understand the behavior of tin whiskers in space environments. The Tin Whisker www site is produced by Code 562. This www site does not provide information pertaining to patented or proprietary information. All of the information contained in this www site is at the level of that produced by industry and university researchers and is published at international conferences.

Shaw, Harry↗

NASA NTRS2000

Parts Engineering Experiences, Philosophies and Trends

This document is the presentation viewgraphs of the NASA presentations to NASDA, outlining the philosophy and trends of the experiences with engineering parts. Included in the presentations: are (1) the assurance of COTS boards for Space flight, and (2) Peer Review for Ice, Cloud and land Elevation Satellite (ICESat) GPS flight receivers EEE parts. The emphasis is on the methods for qualification of available parts for space flight.

Shaw, Harry↗