Engineering topics
Publications and source records attributed to Sandor, M..
This paper discusses the process being used and the results of the selection and qualification of a low cost prepackaged diode laser with a custom packaged microchip laser crystal.
This paper discusses the process being used and the results of the selection and qualification of a low cost prepackaged diode laser with a custom packaged microchip laser crystal.
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Plastic Encapsulated Microelectronics (PEM) reliability is affected by many factors. Glass transition temperature (Tg) is one such factor. In this presentation issues relating to PEM reliability and the effect of low glass transition temperature epoxy mold compounds are presented.
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Many factors influence PEM component reliability.One of the factors that can affect PEM performance and reliability is the glass transition temperature (Tg) and the coefficient of thermal expansion (CTE) of the encapsulant or underfill. JPL/NASA is investigating how the Tg and CTE for PEMs affect device reliability under different temperature and aging conditions. Other issues with Tg are also being investigated. Some preliminary data will be presented on glass transition temperature test results conducted at JPL.
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It is reported by some users and has been demonstrated by others via testing and qualification that the quality and reliability of plastic-encapsulated microcircuits (PEMs) manufactured today are excellent in commercial applications and closely equivalent, and in some cases superior to their hemetic counterparts.
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Acoustic Micro Imaging (AMI) was successfully employed by JPL Office 507 to evaluate comercial off-the shelf (COTS) plastic encapsulated microcircuits (PEMs).
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Engineers within the commercial and aerospace industries are using trade-off and risk analysis to aid in reducing spacecraft system cost while increasing performance and maintaining high reliability.