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Sampson, Michael J.

Publications and source records attributed to Sampson, Michael J..

72 records · Page 4
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NASA NTRS2010

Government-Industry Data Exchange Program (GIDEP) and NASA Advisories

This viewgraph presentation reviews the Government-Industry Data Exchange Program (GIDEP) and NASA Advisories policy to practice. The contents include: 1) Purpose of the Government-Industry Data Exchange Program (GIDEP); 2) NASA and GSFC Documentation; 3) NASA Advisories, differences from GIDEP; 4) GIDEP Distribution by Originator; 5) New Interim GIDEP Policy for Suspect Counterfeits; 6) NASA and Suspect Counterfeits; 7) Threats to GIDEP; and 8) Conclusions and Contact Information.

Sampson, Michael J.↗
NASA NTRS2010

Packaging and Embedded Electronics for the Next Generation

This viewgraph presentation describes examples of electronic packaging that protects an electronic element from handling, contamination, shock, vibration and light penetration. The use of Hermetic and non-hermetic packaging is also discussed. The topics include: 1) What is Electronic Packaging? 2) Why Package Electronic Parts? 3) Evolution of Packaging; 4) General Packaging Discussion; 5) Advanced non-hermetic packages; 6) Discussion of Hermeticity; 7) The Class Y Concept and Possible Extensions; 8) Embedded Technologies; and 9) NEPP Activities.

Sampson, Michael J.↗
NASA NTRS2010

Lead-Free Electronics: Impact for Space Electronics

Pb is used as a constituent in solder alloys used to connect and attach electronic parts to printed wiring boards (PWBs). Similar Pbbearing alloys are electroplated or hot dipped onto the terminations of electronic parts to protect the terminations and make them solderable. Changing to Pb-free solders and termination finishes has introduced significant technical challenges into the supply chain. Tin/lead (Sn/Pb) alloys have been the solders of choice for electronics for more than 50 years. Pb-free solder alloys are available but there is not a plug-in replacement for 60/40 or 63/37 (Sn/Pb) alloys, which have been the industry workhorses.

Sampson, Michael J.↗
NASA NTRS2010

Physical and Electrical Characterization of Aluminum Polymer Capacitors

Polymer aluminum capacitors from several manufacturers with various combinations of capacitance, rated voltage, and ESR values were physically examined and electrically characterized. The physical construction analysis of the capacitors revealed three different capacitor structures, i.e., traditional wound, stacked, and laminated. Electrical characterization results of polymer aluminum capacitors are reported for frequency-domain dielectric response at various temperatures, surge breakdown voltage, and other dielectric properties. The structure-property relations in polymer aluminum capacitors are discussed.

Liu, David↗
NASA NTRS2010

Physical and Electrical Characterization of Polymer Aluminum Capacitors

Polymer aluminum capacitors from several manufacturers with various combinations of capacitance, rated voltage, and ESR values were physically examined and electrically characterized. The physical construction analysis of the capacitors revealed three different capacitor structures, i.e., traditional wound, stacked, and laminated. Electrical characterization results of polymer aluminum capacitors are reported for frequency-domain dielectric response at various temperatures, surge breakdown voltage, and other dielectric properties. The structure-property relations in polymer aluminum capacitors are discussed.

Liu, David↗
NASA NTRS2010

Packaging Concerns and Techniques for Large Devices: Challenges for Complex Electronics

NASA is going to have to accept the use of non-hermetic packages for complex devices. There are a large number of packaging options available. Space application subjects the packages to stresses that they were probably not designed for (vacuum for instance). NASA has to find a way of having assurance in the integrity of the packages. There are manufacturers interested in qualifying non-hermetic packages to MIL-PRF-38535 Class V. Government space users are agreed that Class V should be for hermetic packages only. NASA is working on a new Class for non-hermetic packages for M38535 Appendix B, "Class Y". Testing for package integrity will be required but can be package specific as described by a Package Integrity Test Plan. The plan is developed by the manufacturer and approved by DSCC and government space.

LaBel, Kenneth A.↗
NASA NTRS2010

NASA Electronic Parts and Packaging (NEPP) Program - Update

This slide presentation reviews the goals and mission of the NASA Electronic Parts and Packaging (NEPP) Program. The NEPP mission is to provide guidance to NASA for the selection and application of microelectronics technologies, to improve understanding of the risks related to the use of these technologies in the space environment and to ensure that appropriate research is performed to meet NASA mission assurance needs. The program has been supporting NASA for over 20 years. The focus is on the reliability aspects of electronic devices. In this work the program also supports the electronics industry. There are several areas that the program is involved in: Memories, systems on a chip (SOCs), data conversion devices, power MOSFETS, power converters, scaled CMOS, capacitors, linear devices, fiber optics, and other electronics such as sensors, cryogenic and SiGe that are used in space systems. Each of these area are reviewed with the work that is being done in reliability and effects of radiation on these technologies.

LaBel, Kenneth A.↗
NASA NTRS2009

Packaging Concerns/Techniques for Large Devices

This slide presentation reviews packaging challenges and options for electronic parts. The presentation includes information about non-hermetic packages, space challenges for packaging and complex package variations.

Sampson, Michael J.↗
NASA NTRS2008

NASA Electronic Parts and Packaging (NEPP) Program - Radiation Activities

The NEPP mission is to provide guidance to NASA for the selection and application of microelectronics technologies, to improve understanding of the risks related to the use of these technologies in the space environment and to ensure that appropriate research is performed to meet NASA mission assurance needs.

LaBel, Kenneth A.↗
NASA NTRS2008

Developing a NASA Lead-Free Policy for Electronics - Lessons Learned

The National Aeronautics and Space Administration (NASA) is not required by United States or international law to use lead-free (Pb-free) electronic systems but international pressure in the world market is making it increasingly important that NASA have a Pb-free policy. In fact, given the international nature of the electronics market, all organizations need a Pb-free policy. This paper describes the factors which must be taken into account in formulating the policy, the tools to aid in structuring the policy and the unanticipated and difficult challenges encountered. NASA is participating in a number of forums and teams trying to develop effective approaches to controlling Pb-free adoption in high reliability systems. The activities and status of the work being done by these teams will be described. NASA also continues to gather information on metal whiskers, particularly tin based, and some recent examples will be shared. The current lack of a policy is resulting in "surprises" and the need to disposition undesirable conditions on a case-by-case basis. This is inefficient, costly and can result in sub-optimum outcomes.

Sampson, Michael J.↗
NASA NTRS2008

NASA Electronic Parts and Packaging (NEPP) Program

This viewgraph presentation reviews NASA's Electronic Parts and Packaging (NEPP) Program. The NEPP mission is to provide guidance to NASA for the selection and and application of microelectronics technologies, to improve understanding of the risks related to the use of these technologies in the space environment and to ensure that appropriate research is performed to meet NASA mission needs. The NEPP Program focuses on the reliability aspects of electronic devices. Three principal aspects to this reliability: (1) lifetime, (2) effects of space radiation and the space environment, and (3) creation and maintenance of the assurance support infrastructure required for success.

LaBel, Kenneth A.↗
NASA NTRS2007

The NASA Electronic Parts and Packaging (NEPP) Program: Insertion of New Electronics Technologies

This viewgraph presentation gives an overview of NASA Electronic Parts and Packaging (NEPP) Program's new electronics technology trends. The topics include: 1) The Changing World of Radiation Testing of Memories; 2) Even Application-Specific Tests are Costly!; 3) Hypothetical New Technology Part Qualification Cost; 4) Where we are; 5) Approaching FPGAs as a More Than a "Part" for Reliability; 6) FPGAs Beget Novel Radiation Test Setups; 7) Understanding the Complex Radiation Data; 8) Tracking Packaging Complexity and Reliability for FPGAs; 9) Devices Supporting the FPGA Need to be Considered; 10) Summary of the New Electronic Technologies and Insertion into Flight Programs Workshop; and 11) Highlights of Panel Notes and Comments

LaBel, Kenneth A.↗
NASA NTRS2004

COTS Ceramic Chip Capacitors: An Evaluation of the Parts and Assurance Methodologies

This viewgraph presentation profiles an experiment to evaluate the suitability of commercial off-the-shelf (COTS) ceramic chip capacitors for NASA spaceflight applications. The experiment included: 1) Voltage Conditioning ('Burn-In'); 2) Highly Accelerated Life Test (HALT); 3) Destructive Physical Analysis (DPA); 4) Ultimate Voltage Breakdown Strength. The presentation includes results for each of the capacitors used in the experiment.

Sampson, Michael J.↗
NASA NTRS2004

COTS Ceramic Chip Capacitors: An Evaluation of the Parts and Assurance Methodologies

Commercial-Off-The-Shelf (COTS) multilayer ceramic chip capacitors (MLCCs) are continually evolving to reduce physical size and increase volumetric efficiency. Designers of high reliability aerospace and military systems are attracted to these attributes of COTS MLCCs and would like to take advantage of them while maintaining the high standards for long-term reliable operation they are accustomed io when selecting military qualified established reliability (MIL-ER) MLCCs. However, MIL-ER MLCCs are not available in the full range of small chip sizes with high capacitance as found in today's COTS MLCCs. The objectives for this evaluation were to assess the long-term performance of small case size COTS MLCCs and to identify effective, lower-cost product assurance methodologies. Fifteen (15) lots of COTS X7R dielectric MLCCs from four (4) different manufacturers and two (2) MIL-ER BX dielectric MLCCs from two (2) of the same manufacturers were evaluated. Both 0805 and 0402 chip sizes were included. Several voltage ratings were tested ranging from a high of 50 volts to a low of 6.3 volts. The evaluation consisted of a comprehensive screening and qualification test program based upon MIL-PRF-55681 (i.e., voltage conditioning, thermal shock, moisture resistance, 2000-hour life test, etc.). In addition, several lot characterization tests were performed including Destructive Physical Analysis (DPA), Highly Accelerated Life Test (HALT) and Dielectric Voltage Breakdown Strength. The data analysis included a comparison of the 2000-hour life test results (used as a metric for long-term performance) relative to the screening and characterization test results. Results of this analysis indicate that the long-term life performance of COTS MLCCs is variable -- some lots perform well, some lots perform poorly. DPA and HALT were found to be promising lot characterization tests to identify substandard COTS MLCC lots prior to conducting more expensive screening and qualification tests. The results indicate that lot- specific screening and qualification are still recommended for high reliability applications. One significant and concerning observation is that MIL- type voltage conditioning (100 hours at twice rated voltage, 125 C) was not an effective screen in removing infant mortality parts for the particular lots of COTS MLCCs evaluated.

Brusse, Jay A.↗
NASA NTRS2003

Past, Present and Future Trends for NASA's EEE Parts Program

The foundation of NASA's Electrical, Electronic and Electromechanical (EEE) parts program is standardization. Standardization helps to reduce the number of unknown variables present as a project or program progresses; unknown variables equate to unknown risk. NASA spacecraft are usually 'one-offs' or at least part of a very short run, and every new part that is used represents a risk that has to be understood and mitigated as necessary. This equates directly to time and cost. Standardization of component parts is used to provide a foundation of known, dependable, qualified parts upon which a safe, reliable system can be built. In addition, the evaluation and selection of parts for the standard parts list unifies the activity under one group of experts rather than having engineers on each project overlapping and duplicating efforts. Thus, the project support engineers are able to concentrate on understanding and mitigating the risks for the non standard parts required to meet specific requirements of their project. Rapid technology change is producing conditions that make any form of parts-based standardization increasingly difficult, particularly the use of Commercial Off The Shelf (COTS) parts and assemblies. There are many complications to COTS-based standardization. COTS parts change rapidly and unpredictably, often have different characteristics fiom manufacturer to manufacturer, frequently are only available through distribution, have no universal specification and have variable and unpredictable radiation characteristics. This presentation will discuss some potential approaches to COTS parts standardization. Further into the future, in three to five years perhaps, the use of COTS boards and boxes will be extensive and standardization at these levels of assembly will be necessary. In five to ten years, most major spacecraft functions will probably be performed by COTS boards. How will this be achieved? What role will the parts engineer play, if any? This presentation will borrow from the lessons of the past to suggest some scenarios for the future.

Sampson, Michael J.↗
NASA NTRS1999

Electrostatic Discharge Effects on Thin Film Resistors

Recently, open circuit failures of individual elements in thin film resistor networks have been attributed to electrostatic discharge (ESD) effects. This paper will discuss the investigation that came to this conclusion and subsequent experimentation intended to characterize design factors that affect the sensitivity of resistor elements to ESD. The ESD testing was performed using the standard human body model simulation. Some of the design elements to be evaluated were: trace width, trace length (and thus width to length ratio), specific resistivity of the trace (ohms per square) and resistance value. However, once the experiments were in progress, it was realized that the ESD sensitivity of most of the complex patterns under evaluation was determined by other design and process factors such as trace shape and termination pad spacing. This paper includes pictorial examples of representative ESD failure sites, and provides some options for designing thin film resistors that are ESD resistant. The risks of ESD damage are assessed and handling precautions suggested.

Sampson, Michael J.↗